JPS56113420A - Surface treatment method - Google Patents

Surface treatment method

Info

Publication number
JPS56113420A
JPS56113420A JP1749080A JP1749080A JPS56113420A JP S56113420 A JPS56113420 A JP S56113420A JP 1749080 A JP1749080 A JP 1749080A JP 1749080 A JP1749080 A JP 1749080A JP S56113420 A JPS56113420 A JP S56113420A
Authority
JP
Japan
Prior art keywords
sheet
molded product
lower half
resin molded
hot stamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1749080A
Other languages
Japanese (ja)
Inventor
Toshiichi Murata
Takeshi Muraida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1749080A priority Critical patent/JPS56113420A/en
Publication of JPS56113420A publication Critical patent/JPS56113420A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve a design quality of the appearance and to produce a high- grade sensation, by a method wherein a surface of a resin molded product having a complicated shape is covered with a hot stamp sheet whose whole surface is designed as desired.
CONSTITUTION: After a hot stamp sheet 13, which has a desired design on the whole surface and consists of polyvinyl chloride film having a low tension strength, a low breaking strength, and a high elasticity, is coated with heat sealing adhesives 17, consisting of acryl resin, on the side of a resin molded product 16 covered with the sheet 13, the sheet 13 is sealed between upper and lower half casings 11 and 12. Air is bled through holes 19 and 20, connecting together the upper and lower half casings, by means of a vacuum pump so that the two half casings are set into the same vacuum degree. After the sheet 13 is heated by means of a heater 18, pressurized air is fed through the hole 19, and the hot stamp sheet 13 is placed over a surface of a resin molded product 16 placed in the lower half casing.
COPYRIGHT: (C)1981,JPO&Japio
JP1749080A 1980-02-14 1980-02-14 Surface treatment method Pending JPS56113420A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1749080A JPS56113420A (en) 1980-02-14 1980-02-14 Surface treatment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1749080A JPS56113420A (en) 1980-02-14 1980-02-14 Surface treatment method

Publications (1)

Publication Number Publication Date
JPS56113420A true JPS56113420A (en) 1981-09-07

Family

ID=11945438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1749080A Pending JPS56113420A (en) 1980-02-14 1980-02-14 Surface treatment method

Country Status (1)

Country Link
JP (1) JPS56113420A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63221099A (en) * 1987-03-11 1988-09-14 凸版印刷株式会社 Transfer film
CN104347451A (en) * 2013-07-29 2015-02-11 三星显示有限公司 System for treating substrate, laminating apparatus contained in the system, and method for treating substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63221099A (en) * 1987-03-11 1988-09-14 凸版印刷株式会社 Transfer film
CN104347451A (en) * 2013-07-29 2015-02-11 三星显示有限公司 System for treating substrate, laminating apparatus contained in the system, and method for treating substrate
TWI616346B (en) * 2013-07-29 2018-03-01 三星顯示器有限公司 Substrate treating system and laminating apparatus included in the same, and substrate treating method

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