JPS56110275A - Luminous diode device - Google Patents

Luminous diode device

Info

Publication number
JPS56110275A
JPS56110275A JP1273280A JP1273280A JPS56110275A JP S56110275 A JPS56110275 A JP S56110275A JP 1273280 A JP1273280 A JP 1273280A JP 1273280 A JP1273280 A JP 1273280A JP S56110275 A JPS56110275 A JP S56110275A
Authority
JP
Japan
Prior art keywords
resin
light permeable
indicator plate
permeable resin
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1273280A
Other languages
Japanese (ja)
Inventor
Hiroshi Narita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP1273280A priority Critical patent/JPS56110275A/en
Publication of JPS56110275A publication Critical patent/JPS56110275A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To improve reliability by using a molding of thermosetting resin of low expansion coefficient which adhesion with light permeable resin is satisfactory as an indicator. CONSTITUTION:An indicator plate is manufactured by molding materials such as epoxy resin, unsaturated polyesterdiarylphthalate, melamine resin, etc. The indicator plate 3 is placed in a light permeable resin mold with the former's black painted face turned downward. A lead frame 1 where a luminous diode element 2 is mounted and its wire is bonded at a prearranged position, is deposited on the upward- directed face of the indicator plate 3. Then the lead frame 1 is fixed and a light permeable resin 4 is injected for curing. After these steps, a cured molding is taken out of a mold. Under this constitution, adhesion is satisfactory because the indicator plate 3 and the light permeable resin 4 on its periphery are formed with the same material.
JP1273280A 1980-02-05 1980-02-05 Luminous diode device Pending JPS56110275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1273280A JPS56110275A (en) 1980-02-05 1980-02-05 Luminous diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1273280A JPS56110275A (en) 1980-02-05 1980-02-05 Luminous diode device

Publications (1)

Publication Number Publication Date
JPS56110275A true JPS56110275A (en) 1981-09-01

Family

ID=11813603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1273280A Pending JPS56110275A (en) 1980-02-05 1980-02-05 Luminous diode device

Country Status (1)

Country Link
JP (1) JPS56110275A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296782A (en) * 1990-10-18 1994-03-22 Mitsubishi Denki Kabushiki Kaisha Front mask of display device and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296782A (en) * 1990-10-18 1994-03-22 Mitsubishi Denki Kabushiki Kaisha Front mask of display device and manufacturing method thereof

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