JPS56102591A - Plating method for finger of printed circuit panel - Google Patents

Plating method for finger of printed circuit panel

Info

Publication number
JPS56102591A
JPS56102591A JP232080A JP232080A JPS56102591A JP S56102591 A JPS56102591 A JP S56102591A JP 232080 A JP232080 A JP 232080A JP 232080 A JP232080 A JP 232080A JP S56102591 A JPS56102591 A JP S56102591A
Authority
JP
Japan
Prior art keywords
printed circuit
finger
circuit panel
rubber
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP232080A
Other languages
Japanese (ja)
Inventor
Norizo Nakamura
Koji Sasanami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP232080A priority Critical patent/JPS56102591A/en
Publication of JPS56102591A publication Critical patent/JPS56102591A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To exclude the plating process of the conductive pattern and thus save the cost of materials, by press-fixing a compressed conductive rubber at the boundary between the finger part and the circuit part of a printed circuit panel, and flowing current through the same.
CONSTITUTION: The compressed conductive rubber 6 is press-fixed by e.g. the clamp fixing method at the boundary between the finger part 2 and the circuit part 4 of the printed circuit panel 1. The rubber 6 is composed of a mixture consisting of the conductive powder with rubber, a thermoplastic resin and the like.
COPYRIGHT: (C)1981,JPO&Japio
JP232080A 1980-01-11 1980-01-11 Plating method for finger of printed circuit panel Pending JPS56102591A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP232080A JPS56102591A (en) 1980-01-11 1980-01-11 Plating method for finger of printed circuit panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP232080A JPS56102591A (en) 1980-01-11 1980-01-11 Plating method for finger of printed circuit panel

Publications (1)

Publication Number Publication Date
JPS56102591A true JPS56102591A (en) 1981-08-17

Family

ID=11526024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP232080A Pending JPS56102591A (en) 1980-01-11 1980-01-11 Plating method for finger of printed circuit panel

Country Status (1)

Country Link
JP (1) JPS56102591A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153891A (en) * 1983-02-17 1984-09-01 Matsushita Electric Ind Co Ltd Process for forming partially plated part on conductive body of printed circuit board
DE19543894A1 (en) * 1995-03-07 1996-09-12 Hewlett Packard Co Process for forming interconnections on circuit boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153891A (en) * 1983-02-17 1984-09-01 Matsushita Electric Ind Co Ltd Process for forming partially plated part on conductive body of printed circuit board
DE19543894A1 (en) * 1995-03-07 1996-09-12 Hewlett Packard Co Process for forming interconnections on circuit boards

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