JPS56100669A - Adhesive supplying device - Google Patents
Adhesive supplying deviceInfo
- Publication number
- JPS56100669A JPS56100669A JP209380A JP209380A JPS56100669A JP S56100669 A JPS56100669 A JP S56100669A JP 209380 A JP209380 A JP 209380A JP 209380 A JP209380 A JP 209380A JP S56100669 A JPS56100669 A JP S56100669A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- drum
- vessel
- side plates
- upper tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
Abstract
PURPOSE: To eliminate excessive supply of an adhesive and prevent the deterioration of the adhesive by forming a vessel with the surface of an adhesive coating drum as part of a closed space, and supplying adhesive liquid into the vessel.
CONSTITUTION: A vessel 4 in contact with a coating drum 3 is a box body consisting of both side plates 41, a back plate 43 and a bottom plate 44, and an upper tank 5 is provided in the upper part thereof. The adhesive in the upper tank 5 always flows down into the vessel 4 and fills the same, thereby wetting part of a coating drum 3. If the drum 3 is rotated with the side plates 41 of the vessel 4 kept apart by a suitable distance from the drum 3 surface, the adhesive is thinly coated on the surface of the drum 3 and this is transferred onto the surface of labels 11. The adhesive coated to more than required thickness on the surface of the drum 3 drops downward by being scraped by the outside surface of the side plate 41 on the upper stream side in the drum rotating direction out of the two side plates, so that it is recovered into a receiving tray 7 and is returned into the upper tank 5.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP209380A JPS56100669A (en) | 1980-01-14 | 1980-01-14 | Adhesive supplying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP209380A JPS56100669A (en) | 1980-01-14 | 1980-01-14 | Adhesive supplying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56100669A true JPS56100669A (en) | 1981-08-12 |
Family
ID=11519728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP209380A Pending JPS56100669A (en) | 1980-01-14 | 1980-01-14 | Adhesive supplying device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56100669A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918033A (en) * | 1987-12-24 | 1990-04-17 | International Business Machines Corporation | PECVD (plasma enhanced chemical vapor deposition) method for depositing of tungsten or layers containing tungsten by in situ formation of tungsten fluorides |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4839011A (en) * | 1971-09-19 | 1973-06-08 | ||
| JPS5223579A (en) * | 1975-08-19 | 1977-02-22 | Ulvac Corp | Activation reaction evaporating apparatus |
| JPS5363446A (en) * | 1976-11-16 | 1978-06-06 | Bielomatik Leuze & Co | Apparatus for coating adhesive |
-
1980
- 1980-01-14 JP JP209380A patent/JPS56100669A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4839011A (en) * | 1971-09-19 | 1973-06-08 | ||
| JPS5223579A (en) * | 1975-08-19 | 1977-02-22 | Ulvac Corp | Activation reaction evaporating apparatus |
| JPS5363446A (en) * | 1976-11-16 | 1978-06-06 | Bielomatik Leuze & Co | Apparatus for coating adhesive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918033A (en) * | 1987-12-24 | 1990-04-17 | International Business Machines Corporation | PECVD (plasma enhanced chemical vapor deposition) method for depositing of tungsten or layers containing tungsten by in situ formation of tungsten fluorides |
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