JPS5598836A - Method of and device for connecting semiconductor element - Google Patents

Method of and device for connecting semiconductor element

Info

Publication number
JPS5598836A
JPS5598836A JP549979A JP549979A JPS5598836A JP S5598836 A JPS5598836 A JP S5598836A JP 549979 A JP549979 A JP 549979A JP 549979 A JP549979 A JP 549979A JP S5598836 A JPS5598836 A JP S5598836A
Authority
JP
Japan
Prior art keywords
semiconductor element
connecting semiconductor
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP549979A
Other languages
Japanese (ja)
Inventor
Geran Jirubeeru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to JP549979A priority Critical patent/JPS5598836A/en
Publication of JPS5598836A publication Critical patent/JPS5598836A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP549979A 1979-01-20 1979-01-20 Method of and device for connecting semiconductor element Pending JPS5598836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP549979A JPS5598836A (en) 1979-01-20 1979-01-20 Method of and device for connecting semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP549979A JPS5598836A (en) 1979-01-20 1979-01-20 Method of and device for connecting semiconductor element

Publications (1)

Publication Number Publication Date
JPS5598836A true JPS5598836A (en) 1980-07-28

Family

ID=11612906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP549979A Pending JPS5598836A (en) 1979-01-20 1979-01-20 Method of and device for connecting semiconductor element

Country Status (1)

Country Link
JP (1) JPS5598836A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01103845A (en) * 1987-10-16 1989-04-20 Nec Corp Assembly of bare bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01103845A (en) * 1987-10-16 1989-04-20 Nec Corp Assembly of bare bonding

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