JPS5594955A - Film-forming coating solution - Google Patents

Film-forming coating solution

Info

Publication number
JPS5594955A
JPS5594955A JP135779A JP135779A JPS5594955A JP S5594955 A JPS5594955 A JP S5594955A JP 135779 A JP135779 A JP 135779A JP 135779 A JP135779 A JP 135779A JP S5594955 A JPS5594955 A JP S5594955A
Authority
JP
Japan
Prior art keywords
film
coating solution
forming coating
water
solvent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP135779A
Other languages
Japanese (ja)
Other versions
JPS6221029B2 (en
Inventor
Takeshi Watanabe
Ryoichi Sudo
Fusaji Shoji
Ataru Yokono
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP135779A priority Critical patent/JPS5594955A/en
Publication of JPS5594955A publication Critical patent/JPS5594955A/en
Publication of JPS6221029B2 publication Critical patent/JPS6221029B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Paints Or Removers (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To provide a film-forming coating solution having low melting point and a good workability by a method wherein a water-insoluble solvent having soecified melting and boiling points is added to a ladder organosilicone polymer having phenyl gp. and o-dimethoxybenzene.
CONSTITUTION: A film-forming coating solution consists of (A) polyphenylsilsesquioxane of the formula or a ladder organozilicone polymer essentially consisting of basic structural unit of above polymer and a mixed solvent consisting of (B) 50W99wt% of o-dimethoxybenzene and (C) 1W50wt% of a water-insolble solvent with m.p. of 20°C or lower and b.p. of 185W225°C. (C) is added to compensate insufficient solubility and film-forming property at room temperature of (B) whose m.p. is 22.5°C. As (C), water-insoluble solvent having above described m.p. and b.p. is preferably used.
COPYRIGHT: (C)1980,JPO&Japio
JP135779A 1979-01-12 1979-01-12 Film-forming coating solution Granted JPS5594955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP135779A JPS5594955A (en) 1979-01-12 1979-01-12 Film-forming coating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP135779A JPS5594955A (en) 1979-01-12 1979-01-12 Film-forming coating solution

Publications (2)

Publication Number Publication Date
JPS5594955A true JPS5594955A (en) 1980-07-18
JPS6221029B2 JPS6221029B2 (en) 1987-05-11

Family

ID=11499239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP135779A Granted JPS5594955A (en) 1979-01-12 1979-01-12 Film-forming coating solution

Country Status (1)

Country Link
JP (1) JPS5594955A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6176574A (en) * 1984-09-21 1986-04-19 Dainichi Nippon Cables Ltd Meat-resistant insulating electric wire
JPS61201430A (en) * 1985-03-04 1986-09-06 Fujitsu Ltd Silicone resin film for semiconductor device and formation of the same
GB2237577A (en) * 1989-02-23 1991-05-08 Mitsubishi Electric Corp Method for transferring patterns on silicone ladder type resin and etching solution used in such method
US5183846A (en) * 1990-07-03 1993-02-02 Mitsubishi Denki Kabushiki Kaisha Silicone ladder polymer coating composition
US5236984A (en) * 1990-11-22 1993-08-17 Mitsubishi Denki Kabushiki Kaisha Cold-curable silicone resin composition
WO2014148439A1 (en) * 2013-03-18 2014-09-25 日産化学工業株式会社 Composition, liquid crystal alignment treatment agent, liquid crystal alignment film, and liquid crystal display element

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6176574A (en) * 1984-09-21 1986-04-19 Dainichi Nippon Cables Ltd Meat-resistant insulating electric wire
JPH0580082B2 (en) * 1984-09-21 1993-11-05 Mitsubishi Cable Ind Ltd
JPS61201430A (en) * 1985-03-04 1986-09-06 Fujitsu Ltd Silicone resin film for semiconductor device and formation of the same
JPH0237694B2 (en) * 1985-03-04 1990-08-27 Fujitsu Ltd
GB2237577A (en) * 1989-02-23 1991-05-08 Mitsubishi Electric Corp Method for transferring patterns on silicone ladder type resin and etching solution used in such method
US5087553A (en) * 1989-02-23 1992-02-11 Mitsubishi Denki Kabushiki Kaisha Method for transferring patterns on silicone ladder type resin and etching solution used in such method
GB2237577B (en) * 1989-02-23 1992-11-04 Mitsubishi Electric Corp Solvents for silicone ladder resins for use in an etching process
US5183846A (en) * 1990-07-03 1993-02-02 Mitsubishi Denki Kabushiki Kaisha Silicone ladder polymer coating composition
US5236984A (en) * 1990-11-22 1993-08-17 Mitsubishi Denki Kabushiki Kaisha Cold-curable silicone resin composition
WO2014148439A1 (en) * 2013-03-18 2014-09-25 日産化学工業株式会社 Composition, liquid crystal alignment treatment agent, liquid crystal alignment film, and liquid crystal display element

Also Published As

Publication number Publication date
JPS6221029B2 (en) 1987-05-11

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