JPS559464B2 - - Google Patents

Info

Publication number
JPS559464B2
JPS559464B2 JP3096676A JP3096676A JPS559464B2 JP S559464 B2 JPS559464 B2 JP S559464B2 JP 3096676 A JP3096676 A JP 3096676A JP 3096676 A JP3096676 A JP 3096676A JP S559464 B2 JPS559464 B2 JP S559464B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3096676A
Other languages
Japanese (ja)
Other versions
JPS52114444A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3096676A priority Critical patent/JPS52114444A/ja
Publication of JPS52114444A publication Critical patent/JPS52114444A/ja
Publication of JPS559464B2 publication Critical patent/JPS559464B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
JP3096676A 1976-03-22 1976-03-22 Plasma etching method Granted JPS52114444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3096676A JPS52114444A (en) 1976-03-22 1976-03-22 Plasma etching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3096676A JPS52114444A (en) 1976-03-22 1976-03-22 Plasma etching method

Publications (2)

Publication Number Publication Date
JPS52114444A JPS52114444A (en) 1977-09-26
JPS559464B2 true JPS559464B2 (enrdf_load_stackoverflow) 1980-03-10

Family

ID=12318400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3096676A Granted JPS52114444A (en) 1976-03-22 1976-03-22 Plasma etching method

Country Status (1)

Country Link
JP (1) JPS52114444A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001024248A1 (en) * 1999-09-27 2001-04-05 Applied Materials, Inc. Hydrocarbon gases for anisotropic etching of metal-containing layers
US7049244B2 (en) 1992-06-15 2006-05-23 Micron Technology, Inc. Method for enhancing silicon dioxide to silicon nitride selectivity

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114840A (ja) * 1982-12-22 1984-07-03 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP2619395B2 (ja) * 1987-07-10 1997-06-11 株式会社日立製作所 プラズマ処理方法
JPS6489518A (en) * 1987-09-30 1989-04-04 Nec Corp Parallel flat board electrode type plasma etching device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576691B2 (enrdf_load_stackoverflow) * 1972-06-17 1982-02-06
GB1417085A (en) * 1973-05-17 1975-12-10 Standard Telephones Cables Ltd Plasma etching
JPS5740650B2 (enrdf_load_stackoverflow) * 1973-08-11 1982-08-28

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049244B2 (en) 1992-06-15 2006-05-23 Micron Technology, Inc. Method for enhancing silicon dioxide to silicon nitride selectivity
WO2001024248A1 (en) * 1999-09-27 2001-04-05 Applied Materials, Inc. Hydrocarbon gases for anisotropic etching of metal-containing layers

Also Published As

Publication number Publication date
JPS52114444A (en) 1977-09-26

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