JPS5592269A - Ring solder forming and supplying device - Google Patents

Ring solder forming and supplying device

Info

Publication number
JPS5592269A
JPS5592269A JP21979A JP21979A JPS5592269A JP S5592269 A JPS5592269 A JP S5592269A JP 21979 A JP21979 A JP 21979A JP 21979 A JP21979 A JP 21979A JP S5592269 A JPS5592269 A JP S5592269A
Authority
JP
Japan
Prior art keywords
shaft
forming
solder
ring
forming part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21979A
Other languages
Japanese (ja)
Inventor
Noriya Wada
Yuji Wakabayashi
Kazuhiko Miyazaki
Kenji Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP21979A priority Critical patent/JPS5592269A/en
Publication of JPS5592269A publication Critical patent/JPS5592269A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To feed ring solder automatically to desired work position in an inexpensive device of simple constitution, by cutting a bar solder in the forming part shaft part to form into a ring, dropping and holding in the supply part in the lower part of the shaft part, and moving the forming and supply parts integrally in the vertical or lateral direction.
CONSTITUTION: A bar solder 1 is sent to a shaft 2 in rectangular direction, and is cut to a specified length by a cutting blade 3 which is operated by a cam lever. The cut solder is held so as not to drop off, and is formed in a ring by the movement of forming arrows 5W7 directed to a forming part 4 on the shaft 2, and is wound up on the forming part 4. After retreat of the forming arrows 5W7, a stripper 8 is lowered by the cam drive, and the ring solder drops off the forming part 4 and is held by a stopper 9 in a small shaft diameter part. The shaft 2 and forming part 4 are constituted as piston rod of air cylinder 11, and eccentric motion is created around a shaft 12 which is also used as air lead-in pipe, so that the ring solder 15 may be supplied to an arbitrary position on the work 10.
COPYRIGHT: (C)1980,JPO&Japio
JP21979A 1979-01-08 1979-01-08 Ring solder forming and supplying device Pending JPS5592269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21979A JPS5592269A (en) 1979-01-08 1979-01-08 Ring solder forming and supplying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21979A JPS5592269A (en) 1979-01-08 1979-01-08 Ring solder forming and supplying device

Publications (1)

Publication Number Publication Date
JPS5592269A true JPS5592269A (en) 1980-07-12

Family

ID=11467843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21979A Pending JPS5592269A (en) 1979-01-08 1979-01-08 Ring solder forming and supplying device

Country Status (1)

Country Link
JP (1) JPS5592269A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6213266A (en) * 1985-07-11 1987-01-22 Hitachi Ltd Solder formation feeding instrument
US5421504A (en) * 1991-12-13 1995-06-06 Spirig; Ernest Soldering device and solder dispenser

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6213266A (en) * 1985-07-11 1987-01-22 Hitachi Ltd Solder formation feeding instrument
US5421504A (en) * 1991-12-13 1995-06-06 Spirig; Ernest Soldering device and solder dispenser

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