JPS5591979A - Recovering and circulating apparatus for alkaline etching waste solution - Google Patents

Recovering and circulating apparatus for alkaline etching waste solution

Info

Publication number
JPS5591979A
JPS5591979A JP16283978A JP16283978A JPS5591979A JP S5591979 A JPS5591979 A JP S5591979A JP 16283978 A JP16283978 A JP 16283978A JP 16283978 A JP16283978 A JP 16283978A JP S5591979 A JPS5591979 A JP S5591979A
Authority
JP
Japan
Prior art keywords
container
soln
copper
recovering
water layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16283978A
Other languages
Japanese (ja)
Inventor
Noriaki Tsukada
Kunio Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamatoya and Co Ltd
Original Assignee
Yamatoya and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamatoya and Co Ltd filed Critical Yamatoya and Co Ltd
Priority to JP16283978A priority Critical patent/JPS5591979A/en
Publication of JPS5591979A publication Critical patent/JPS5591979A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To enable NH3 and chlorine ion to be recycled by combinedly setting a unit for separating an etching waste soln. into a copper-contg. oil layer and a water layer with a copper extracting reagent, a unit for treating the oil layer with sulfuric acid, a unit for treating the water layer with a recovering soln., etc. through control mechanisms. CONSTITUTION:An alkali etching waste soln. contg. Cu(NH3)3Cl, etc. is introduced into copper extraction container 12 through auxiliary container 3 and waste soln. container 8. In container 12 a copper extracting reagent is added to the soln. from container 14 and agitated to separate the soln. into an oil layer (R2Cu) and a water layer [Cu(NH3)2Cl] through separation plate 63. The water layer is introduced into container 26 through oil adsorption column 25, pH-adjusted, and treated with a recovering soln. (NH3 soln. + ammonium chlirode) from container 29 to regenerate NH3 and chlorine ion according to the reaction equation. They are fed to container 34 and recycled to etching machine 1. On the other hand, the oil layer is treated with sulfuric acid in back extraction container 41 to be separated into RH and copper sulfate. Copper is recovered from the copper sulfate, and the RH is reused as the copper extracting reagent through containers 48, 14. The above- mentioned operations are automatically controlled with control box 5 through pumps, level gauges, pH meters, etc.
JP16283978A 1978-12-29 1978-12-29 Recovering and circulating apparatus for alkaline etching waste solution Pending JPS5591979A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16283978A JPS5591979A (en) 1978-12-29 1978-12-29 Recovering and circulating apparatus for alkaline etching waste solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16283978A JPS5591979A (en) 1978-12-29 1978-12-29 Recovering and circulating apparatus for alkaline etching waste solution

Publications (1)

Publication Number Publication Date
JPS5591979A true JPS5591979A (en) 1980-07-11

Family

ID=15762216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16283978A Pending JPS5591979A (en) 1978-12-29 1978-12-29 Recovering and circulating apparatus for alkaline etching waste solution

Country Status (1)

Country Link
JP (1) JPS5591979A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0638662A1 (en) * 1993-08-13 1995-02-15 IN.TEC. ITALIA INTERNATIONAL ENVIRONMENT TECHNOLOGY S.r.l. A process for recovering spent metal etching solutions
WO1999013130A1 (en) * 1997-09-10 1999-03-18 Grs Recycling Gmbh & Co. Kg Method for preparing alkaline metal-containing etching solutions
WO1999051795A1 (en) * 1998-04-06 1999-10-14 Celi Ivo L Method for preparing alkaline etching solutions containing metal
KR20000058364A (en) * 2000-05-02 2000-10-05 정진동 The methods of copper sulpate extract from copper erodibility waste sludge in the electronic circuit board panel.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0638662A1 (en) * 1993-08-13 1995-02-15 IN.TEC. ITALIA INTERNATIONAL ENVIRONMENT TECHNOLOGY S.r.l. A process for recovering spent metal etching solutions
WO1999013130A1 (en) * 1997-09-10 1999-03-18 Grs Recycling Gmbh & Co. Kg Method for preparing alkaline metal-containing etching solutions
WO1999051795A1 (en) * 1998-04-06 1999-10-14 Celi Ivo L Method for preparing alkaline etching solutions containing metal
KR20000058364A (en) * 2000-05-02 2000-10-05 정진동 The methods of copper sulpate extract from copper erodibility waste sludge in the electronic circuit board panel.

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