JPS55905B1 - - Google Patents
Info
- Publication number
- JPS55905B1 JPS55905B1 JP3235971A JP3235971A JPS55905B1 JP S55905 B1 JPS55905 B1 JP S55905B1 JP 3235971 A JP3235971 A JP 3235971A JP 3235971 A JP3235971 A JP 3235971A JP S55905 B1 JPS55905 B1 JP S55905B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/464—Additional interconnections in combination with leadframes
- H10W70/466—Tape carriers or flat leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2023680A DE2023680C3 (de) | 1970-05-14 | 1970-05-14 | Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55905B1 true JPS55905B1 (en:Method) | 1980-01-10 |
Family
ID=5771149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3235971A Pending JPS55905B1 (en:Method) | 1970-05-14 | 1971-05-14 |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS55905B1 (en:Method) |
| AT (1) | AT321996B (en:Method) |
| CA (1) | CA938737A (en:Method) |
| CH (1) | CH524247A (en:Method) |
| DE (1) | DE2023680C3 (en:Method) |
| GB (1) | GB1307038A (en:Method) |
| NL (1) | NL7106597A (en:Method) |
| SE (1) | SE365652B (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63193496U (en:Method) * | 1987-05-30 | 1988-12-13 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2431987C2 (de) * | 1974-07-03 | 1983-09-01 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger |
-
1970
- 1970-05-14 DE DE2023680A patent/DE2023680C3/de not_active Expired
-
1971
- 1971-04-16 CH CH552271A patent/CH524247A/de not_active IP Right Cessation
- 1971-04-29 AT AT370971A patent/AT321996B/de not_active IP Right Cessation
- 1971-05-13 SE SE06280/71A patent/SE365652B/xx unknown
- 1971-05-13 GB GB1481571*[A patent/GB1307038A/en not_active Expired
- 1971-05-13 NL NL7106597A patent/NL7106597A/xx unknown
- 1971-05-14 CA CA113024A patent/CA938737A/en not_active Expired
- 1971-05-14 JP JP3235971A patent/JPS55905B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63193496U (en:Method) * | 1987-05-30 | 1988-12-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| CH524247A (de) | 1972-06-15 |
| DE2023680C3 (de) | 1975-07-24 |
| DE2023680B2 (de) | 1974-12-19 |
| NL7106597A (en:Method) | 1971-11-16 |
| SE365652B (en:Method) | 1974-03-25 |
| GB1307038A (en) | 1973-02-14 |
| AT321996B (de) | 1975-04-25 |
| CA938737A (en) | 1973-12-18 |
| DE2023680A1 (de) | 1971-11-25 |