JPS5582630A - Molding of thermosetting resin - Google Patents

Molding of thermosetting resin

Info

Publication number
JPS5582630A
JPS5582630A JP15833778A JP15833778A JPS5582630A JP S5582630 A JPS5582630 A JP S5582630A JP 15833778 A JP15833778 A JP 15833778A JP 15833778 A JP15833778 A JP 15833778A JP S5582630 A JPS5582630 A JP S5582630A
Authority
JP
Japan
Prior art keywords
temperature
molding
thermosetting resin
lapse
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15833778A
Other languages
Japanese (ja)
Other versions
JPS5543902B2 (en
Inventor
Haruki Yokono
Tadao Arai
Saburo Amano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP15833778A priority Critical patent/JPS5582630A/en
Publication of JPS5582630A publication Critical patent/JPS5582630A/en
Publication of JPS5543902B2 publication Critical patent/JPS5543902B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To obtain a molding with excellent machanical, thermal and electrical properties by heating a molding material using a thermosetting resin as binder at a temperature lower than the molding temperature and elevating the temperature of the molding machine after the central temperature by the reaction heat has passed the peak.
CONSTITUTION: The molding material using a thermosetting resin as binder is heated to a temperature T0 lower than the molding heating temperature, and after the lapse of the time t1, the molding surface temperature 2 is brought up to the temperature T0. Then, after the lapse of the time t2 at which the temperature 3 of the central part of the molding by the reaction heat has passed the peak, the temperature 1 of the molding machine is elevated to a required temperature to effect setting of the resin.
COPYRIGHT: (C)1980,JPO&Japio
JP15833778A 1978-12-20 1978-12-20 Molding of thermosetting resin Granted JPS5582630A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15833778A JPS5582630A (en) 1978-12-20 1978-12-20 Molding of thermosetting resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15833778A JPS5582630A (en) 1978-12-20 1978-12-20 Molding of thermosetting resin

Publications (2)

Publication Number Publication Date
JPS5582630A true JPS5582630A (en) 1980-06-21
JPS5543902B2 JPS5543902B2 (en) 1980-11-08

Family

ID=15669423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15833778A Granted JPS5582630A (en) 1978-12-20 1978-12-20 Molding of thermosetting resin

Country Status (1)

Country Link
JP (1) JPS5582630A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02250303A (en) * 1989-03-24 1990-10-08 Furukawa Electric Co Ltd:The Manufacture of plastic magnet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02250303A (en) * 1989-03-24 1990-10-08 Furukawa Electric Co Ltd:The Manufacture of plastic magnet

Also Published As

Publication number Publication date
JPS5543902B2 (en) 1980-11-08

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