JPS557974Y2 - - Google Patents

Info

Publication number
JPS557974Y2
JPS557974Y2 JP1973139875U JP13987573U JPS557974Y2 JP S557974 Y2 JPS557974 Y2 JP S557974Y2 JP 1973139875 U JP1973139875 U JP 1973139875U JP 13987573 U JP13987573 U JP 13987573U JP S557974 Y2 JPS557974 Y2 JP S557974Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1973139875U
Other languages
Japanese (ja)
Other versions
JPS5081785U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973139875U priority Critical patent/JPS557974Y2/ja
Publication of JPS5081785U publication Critical patent/JPS5081785U/ja
Application granted granted Critical
Publication of JPS557974Y2 publication Critical patent/JPS557974Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1973139875U 1973-12-03 1973-12-03 Expired JPS557974Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973139875U JPS557974Y2 (cs) 1973-12-03 1973-12-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973139875U JPS557974Y2 (cs) 1973-12-03 1973-12-03

Publications (2)

Publication Number Publication Date
JPS5081785U JPS5081785U (cs) 1975-07-14
JPS557974Y2 true JPS557974Y2 (cs) 1980-02-21

Family

ID=28416501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973139875U Expired JPS557974Y2 (cs) 1973-12-03 1973-12-03

Country Status (1)

Country Link
JP (1) JPS557974Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2578009B2 (ja) * 1990-06-12 1997-02-05 シャープ株式会社 Ｌｅｄ発光表示素子のモールド方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5331746U (cs) * 1976-08-24 1978-03-18

Also Published As

Publication number Publication date
JPS5081785U (cs) 1975-07-14

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