JPS557944B2 - - Google Patents
Info
- Publication number
- JPS557944B2 JPS557944B2 JP14150175A JP14150175A JPS557944B2 JP S557944 B2 JPS557944 B2 JP S557944B2 JP 14150175 A JP14150175 A JP 14150175A JP 14150175 A JP14150175 A JP 14150175A JP S557944 B2 JPS557944 B2 JP S557944B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Automatic Assembly (AREA)
- Control Of Conveyors (AREA)
- Attitude Control For Articles On Conveyors (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50141501A JPS5265674A (en) | 1975-11-26 | 1975-11-26 | Apparatus for transferring leadframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50141501A JPS5265674A (en) | 1975-11-26 | 1975-11-26 | Apparatus for transferring leadframe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5265674A JPS5265674A (en) | 1977-05-31 |
| JPS557944B2 true JPS557944B2 (2) | 1980-02-29 |
Family
ID=15293403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50141501A Granted JPS5265674A (en) | 1975-11-26 | 1975-11-26 | Apparatus for transferring leadframe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5265674A (2) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2739248B2 (ja) * | 1989-11-06 | 1998-04-15 | ローム株式会社 | 電子装置製造基板の位置決め送り機構およびこれに用いる電子装置製造基板 |
-
1975
- 1975-11-26 JP JP50141501A patent/JPS5265674A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5265674A (en) | 1977-05-31 |