JPS5265674A - Apparatus for transferring leadframe - Google Patents
Apparatus for transferring leadframeInfo
- Publication number
- JPS5265674A JPS5265674A JP50141501A JP14150175A JPS5265674A JP S5265674 A JPS5265674 A JP S5265674A JP 50141501 A JP50141501 A JP 50141501A JP 14150175 A JP14150175 A JP 14150175A JP S5265674 A JPS5265674 A JP S5265674A
- Authority
- JP
- Japan
- Prior art keywords
- leadframe
- transferring
- transferring leadframe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automatic Assembly (AREA)
- Control Of Conveyors (AREA)
- Attitude Control For Articles On Conveyors (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50141501A JPS5265674A (en) | 1975-11-26 | 1975-11-26 | Apparatus for transferring leadframe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50141501A JPS5265674A (en) | 1975-11-26 | 1975-11-26 | Apparatus for transferring leadframe |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5265674A true JPS5265674A (en) | 1977-05-31 |
JPS557944B2 JPS557944B2 (ja) | 1980-02-29 |
Family
ID=15293403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50141501A Granted JPS5265674A (en) | 1975-11-26 | 1975-11-26 | Apparatus for transferring leadframe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5265674A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03148857A (ja) * | 1989-11-06 | 1991-06-25 | Rohm Co Ltd | 電子装置製造基板の位置決め送り機構およびこれに用いる電子装置製造基板 |
-
1975
- 1975-11-26 JP JP50141501A patent/JPS5265674A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03148857A (ja) * | 1989-11-06 | 1991-06-25 | Rohm Co Ltd | 電子装置製造基板の位置決め送り機構およびこれに用いる電子装置製造基板 |
Also Published As
Publication number | Publication date |
---|---|
JPS557944B2 (ja) | 1980-02-29 |
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