JPS5574151A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS5574151A
JPS5574151A JP15191579A JP15191579A JPS5574151A JP S5574151 A JPS5574151 A JP S5574151A JP 15191579 A JP15191579 A JP 15191579A JP 15191579 A JP15191579 A JP 15191579A JP S5574151 A JPS5574151 A JP S5574151A
Authority
JP
Japan
Prior art keywords
bonding
wire bonding
head
bonding head
bonding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15191579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6352777B2 (https=
Inventor
Jiyosefu Eresu Richiyaado
Uiriamu Kuritsuk Furederitsuku
Eriizaa Seido Moshie
Sofuaa Arubaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Industries Inc
Original Assignee
Kulicke and Soffa Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke and Soffa Industries Inc filed Critical Kulicke and Soffa Industries Inc
Publication of JPS5574151A publication Critical patent/JPS5574151A/ja
Publication of JPS6352777B2 publication Critical patent/JPS6352777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/32—Articulated members
    • Y10T403/32606—Pivoted
    • Y10T403/32631—Universal ball and socket
    • Y10T403/32672—Swiveled ball parts or seat
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/32—Articulated members
    • Y10T403/32975—Rotatable
    • Y10T403/32983—Rod in socket
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP15191579A 1978-11-22 1979-11-22 Wire bonding device Granted JPS5574151A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/963,167 US4239144A (en) 1978-11-22 1978-11-22 Apparatus for wire bonding

Publications (2)

Publication Number Publication Date
JPS5574151A true JPS5574151A (en) 1980-06-04
JPS6352777B2 JPS6352777B2 (https=) 1988-10-20

Family

ID=25506834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15191579A Granted JPS5574151A (en) 1978-11-22 1979-11-22 Wire bonding device

Country Status (2)

Country Link
US (1) US4239144A (https=)
JP (1) JPS5574151A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140045358A (ko) 2011-05-17 2014-04-16 가부시키가이샤 신가와 와이어본딩 장치 및 본딩 방법
CN114505569A (zh) * 2022-01-26 2022-05-17 广州金智为电气有限公司 一种自动点焊设备的拔线机构
CN119275119A (zh) * 2024-12-10 2025-01-07 合肥显耀显示科技有限公司 一种微显示屏焊线键合装置及方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154740A (en) * 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device
JPS5698900A (en) 1980-01-07 1981-08-08 Hitachi Ltd Device for automatically wiring printed circuit board
US4326115A (en) * 1980-07-18 1982-04-20 Odetics, Inc. Continuous thru-wire welding machine
US4422568A (en) * 1981-01-12 1983-12-27 Kulicke And Soffa Industries, Inc. Method of making constant bonding wire tail lengths
US4603803A (en) * 1982-08-24 1986-08-05 Asm Assembly Automation, Ltd. Wire bonding apparatus
US4525852A (en) * 1983-03-15 1985-06-25 Micronix Partners Alignment apparatus
US4619395A (en) * 1985-10-04 1986-10-28 Kulicke And Soffa Industries, Inc. Low inertia movable workstation
US4759073A (en) * 1985-11-15 1988-07-19 Kulicke & Soffa Industries, Inc. Bonding apparatus with means and method for automatic calibration using pattern recognition
DD279979B5 (de) * 1987-02-25 1994-07-21 Css Semiconductor Equipment Gm Vorrichtung fuer die Ultraschallkontaktierung
US4826069A (en) * 1988-03-21 1989-05-02 Asm Assembly Automation, Ltd. Work chuck for wire bonder and method
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5459672A (en) * 1990-07-30 1995-10-17 Hughes Aircraft Company Electrical interconnect integrity measuring method
JP2789384B2 (ja) * 1990-10-16 1998-08-20 株式会社新川 タブテープへの半導体素子接合方法及び超音波ボンデイング装置
US5868300A (en) * 1995-06-29 1999-02-09 Orthodyne Electronics Corporation Articulated wire bonder
US6102275A (en) * 1998-07-10 2000-08-15 Palomar Technologies, Inc. Bond head having dual axes of motion
SG106573A1 (en) * 1998-12-23 2004-10-29 Esec Sa Electromagnetic drive device
US6808102B1 (en) * 2000-08-28 2004-10-26 Asm Assembly Automation Ltd. Wire-bonding apparatus with improved XY-table orientation
SG114754A1 (en) * 2004-02-25 2005-09-28 Kulicke & Soffa Investments Laser cleaning system for a wire bonding machine
US20060219754A1 (en) * 2005-03-31 2006-10-05 Horst Clauberg Bonding wire cleaning unit and method of wire bonding using same
US7762449B2 (en) * 2008-11-21 2010-07-27 Asm Assembly Automation Ltd Bond head for heavy wire bonder
US8129220B2 (en) * 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
CN107127447B (zh) * 2017-07-04 2022-10-04 东莞市凯格精机股份有限公司 一种焊线机及其焊头运动装置
CN113172180A (zh) * 2021-04-14 2021-07-27 深圳市泰达智能装备有限公司 一种粗铝线键合机

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3125906A (en) * 1964-03-24 Lead bonding machine
US1086145A (en) * 1911-09-25 1914-02-03 Flannery Bolt Co Stay-bolt.
US2946120A (en) * 1959-05-04 1960-07-26 Aeroprojects Inc Seam vibratory welding apparatus and method
US3242029A (en) * 1963-05-13 1966-03-22 Kleer Vu Ind Inc Ultrasonic sealer for sealing plastics
US3409977A (en) * 1963-10-28 1968-11-12 Texas Instruments Inc Hot gas thermo-compression bonding
US3997100A (en) * 1973-09-10 1976-12-14 Raytheon Company Method of beam lead bonding
US3960309A (en) * 1974-07-31 1976-06-01 International Business Machines Corporation Fine wire twisted pair routing and connecting system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140045358A (ko) 2011-05-17 2014-04-16 가부시키가이샤 신가와 와이어본딩 장치 및 본딩 방법
US9337166B2 (en) 2011-05-17 2016-05-10 Shinkawa Ltd. Wire bonding apparatus and bonding method
CN114505569A (zh) * 2022-01-26 2022-05-17 广州金智为电气有限公司 一种自动点焊设备的拔线机构
CN119275119A (zh) * 2024-12-10 2025-01-07 合肥显耀显示科技有限公司 一种微显示屏焊线键合装置及方法

Also Published As

Publication number Publication date
JPS6352777B2 (https=) 1988-10-20
US4239144A (en) 1980-12-16

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