JPS5574048U - - Google Patents
Info
- Publication number
- JPS5574048U JPS5574048U JP1978156820U JP15682078U JPS5574048U JP S5574048 U JPS5574048 U JP S5574048U JP 1978156820 U JP1978156820 U JP 1978156820U JP 15682078 U JP15682078 U JP 15682078U JP S5574048 U JPS5574048 U JP S5574048U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978156820U JPS5814610Y2 (en) | 1978-11-15 | 1978-11-15 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978156820U JPS5814610Y2 (en) | 1978-11-15 | 1978-11-15 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5574048U true JPS5574048U (en) | 1980-05-21 |
| JPS5814610Y2 JPS5814610Y2 (en) | 1983-03-23 |
Family
ID=29147152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978156820U Expired JPS5814610Y2 (en) | 1978-11-15 | 1978-11-15 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5814610Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020508220A (en) * | 2017-02-20 | 2020-03-19 | ウィラ・ベスローテン・フェンノートシャップＷｉｌａ Ｂ．Ｖ． | Device for fixing a tool and method for manufacturing such a device |
| WO2024090027A1 (en) * | 2022-10-26 | 2024-05-02 | ソニーセミコンダクタソリューションズ株式会社 | Package and method for manufacturing package |
-
1978
- 1978-11-15 JP JP1978156820U patent/JPS5814610Y2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020508220A (en) * | 2017-02-20 | 2020-03-19 | ウィラ・ベスローテン・フェンノートシャップＷｉｌａ Ｂ．Ｖ． | Device for fixing a tool and method for manufacturing such a device |
| WO2024090027A1 (en) * | 2022-10-26 | 2024-05-02 | ソニーセミコンダクタソリューションズ株式会社 | Package and method for manufacturing package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5814610Y2 (en) | 1983-03-23 |