JPS556809A - Method of forming through hole at multiilayer printed circuit board by laser beam - Google Patents

Method of forming through hole at multiilayer printed circuit board by laser beam

Info

Publication number
JPS556809A
JPS556809A JP7804578A JP7804578A JPS556809A JP S556809 A JPS556809 A JP S556809A JP 7804578 A JP7804578 A JP 7804578A JP 7804578 A JP7804578 A JP 7804578A JP S556809 A JPS556809 A JP S556809A
Authority
JP
Japan
Prior art keywords
hole
forming
circuit board
laser beam
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7804578A
Other languages
Japanese (ja)
Inventor
Kaoru Hashimoto
Kouichi Niwa
Kiyouhei Murakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7804578A priority Critical patent/JPS556809A/en
Publication of JPS556809A publication Critical patent/JPS556809A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laser Beam Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP7804578A 1978-06-29 1978-06-29 Method of forming through hole at multiilayer printed circuit board by laser beam Pending JPS556809A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7804578A JPS556809A (en) 1978-06-29 1978-06-29 Method of forming through hole at multiilayer printed circuit board by laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7804578A JPS556809A (en) 1978-06-29 1978-06-29 Method of forming through hole at multiilayer printed circuit board by laser beam

Publications (1)

Publication Number Publication Date
JPS556809A true JPS556809A (en) 1980-01-18

Family

ID=13650866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7804578A Pending JPS556809A (en) 1978-06-29 1978-06-29 Method of forming through hole at multiilayer printed circuit board by laser beam

Country Status (1)

Country Link
JP (1) JPS556809A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186389A (en) * 1981-05-11 1982-11-16 Hitachi Ltd Method of opening hole of printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186389A (en) * 1981-05-11 1982-11-16 Hitachi Ltd Method of opening hole of printed board

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