JPS5563183U - - Google Patents

Info

Publication number
JPS5563183U
JPS5563183U JP14578578U JP14578578U JPS5563183U JP S5563183 U JPS5563183 U JP S5563183U JP 14578578 U JP14578578 U JP 14578578U JP 14578578 U JP14578578 U JP 14578578U JP S5563183 U JPS5563183 U JP S5563183U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14578578U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14578578U priority Critical patent/JPS5563183U/ja
Publication of JPS5563183U publication Critical patent/JPS5563183U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14578578U 1978-10-25 1978-10-25 Pending JPS5563183U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14578578U JPS5563183U (en) 1978-10-25 1978-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14578578U JPS5563183U (en) 1978-10-25 1978-10-25

Publications (1)

Publication Number Publication Date
JPS5563183U true JPS5563183U (en) 1980-04-30

Family

ID=29125671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14578578U Pending JPS5563183U (en) 1978-10-25 1978-10-25

Country Status (1)

Country Link
JP (1) JPS5563183U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269508A (en) * 2005-03-22 2006-10-05 Hitachi Ltd Printed-wiring board and method of determining erosion state
JP2007201126A (en) * 2006-01-26 2007-08-09 Mitsubishi Electric Corp Copper concentration estimation method in fused solder, and printed board used therefor
WO2019194071A1 (en) * 2018-04-02 2019-10-10 三菱電機株式会社 Solder jet flow inspection device, mounting board, and jet flow inspection method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4935254A (en) * 1972-08-07 1974-04-01
JPS4943161A (en) * 1972-08-31 1974-04-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4935254A (en) * 1972-08-07 1974-04-01
JPS4943161A (en) * 1972-08-31 1974-04-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269508A (en) * 2005-03-22 2006-10-05 Hitachi Ltd Printed-wiring board and method of determining erosion state
JP2007201126A (en) * 2006-01-26 2007-08-09 Mitsubishi Electric Corp Copper concentration estimation method in fused solder, and printed board used therefor
WO2019194071A1 (en) * 2018-04-02 2019-10-10 三菱電機株式会社 Solder jet flow inspection device, mounting board, and jet flow inspection method

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