JPS5563183U - - Google Patents
Info
- Publication number
- JPS5563183U JPS5563183U JP14578578U JP14578578U JPS5563183U JP S5563183 U JPS5563183 U JP S5563183U JP 14578578 U JP14578578 U JP 14578578U JP 14578578 U JP14578578 U JP 14578578U JP S5563183 U JPS5563183 U JP S5563183U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14578578U JPS5563183U (en) | 1978-10-25 | 1978-10-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14578578U JPS5563183U (en) | 1978-10-25 | 1978-10-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5563183U true JPS5563183U (en) | 1980-04-30 |
Family
ID=29125671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14578578U Pending JPS5563183U (en) | 1978-10-25 | 1978-10-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5563183U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006269508A (en) * | 2005-03-22 | 2006-10-05 | Hitachi Ltd | Printed-wiring board and method of determining erosion state |
JP2007201126A (en) * | 2006-01-26 | 2007-08-09 | Mitsubishi Electric Corp | Copper concentration estimation method in fused solder, and printed board used therefor |
WO2019194071A1 (en) * | 2018-04-02 | 2019-10-10 | 三菱電機株式会社 | Solder jet flow inspection device, mounting board, and jet flow inspection method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4935254A (en) * | 1972-08-07 | 1974-04-01 | ||
JPS4943161A (en) * | 1972-08-31 | 1974-04-23 |
-
1978
- 1978-10-25 JP JP14578578U patent/JPS5563183U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4935254A (en) * | 1972-08-07 | 1974-04-01 | ||
JPS4943161A (en) * | 1972-08-31 | 1974-04-23 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006269508A (en) * | 2005-03-22 | 2006-10-05 | Hitachi Ltd | Printed-wiring board and method of determining erosion state |
JP2007201126A (en) * | 2006-01-26 | 2007-08-09 | Mitsubishi Electric Corp | Copper concentration estimation method in fused solder, and printed board used therefor |
WO2019194071A1 (en) * | 2018-04-02 | 2019-10-10 | 三菱電機株式会社 | Solder jet flow inspection device, mounting board, and jet flow inspection method |