JPS5561047A - Semiconductor device for electric power - Google Patents
Semiconductor device for electric powerInfo
- Publication number
- JPS5561047A JPS5561047A JP13424578A JP13424578A JPS5561047A JP S5561047 A JPS5561047 A JP S5561047A JP 13424578 A JP13424578 A JP 13424578A JP 13424578 A JP13424578 A JP 13424578A JP S5561047 A JPS5561047 A JP S5561047A
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- electrode
- plate
- cooling plate
- teflon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13424578A JPS5561047A (en) | 1978-10-31 | 1978-10-31 | Semiconductor device for electric power |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13424578A JPS5561047A (en) | 1978-10-31 | 1978-10-31 | Semiconductor device for electric power |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5561047A true JPS5561047A (en) | 1980-05-08 |
JPS6223463B2 JPS6223463B2 (enrdf_load_stackoverflow) | 1987-05-22 |
Family
ID=15123782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13424578A Granted JPS5561047A (en) | 1978-10-31 | 1978-10-31 | Semiconductor device for electric power |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5561047A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999062117A1 (en) * | 1998-05-28 | 1999-12-02 | Ericsson Inc. | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
-
1978
- 1978-10-31 JP JP13424578A patent/JPS5561047A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999062117A1 (en) * | 1998-05-28 | 1999-12-02 | Ericsson Inc. | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
US6181006B1 (en) * | 1998-05-28 | 2001-01-30 | Ericsson Inc. | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
Also Published As
Publication number | Publication date |
---|---|
JPS6223463B2 (enrdf_load_stackoverflow) | 1987-05-22 |
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