JPS5561032A - Semiconductor element - Google Patents

Semiconductor element

Info

Publication number
JPS5561032A
JPS5561032A JP13415678A JP13415678A JPS5561032A JP S5561032 A JPS5561032 A JP S5561032A JP 13415678 A JP13415678 A JP 13415678A JP 13415678 A JP13415678 A JP 13415678A JP S5561032 A JPS5561032 A JP S5561032A
Authority
JP
Japan
Prior art keywords
stand
base
holes
poles
deflection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13415678A
Other languages
Japanese (ja)
Inventor
Masaaki Sadamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13415678A priority Critical patent/JPS5561032A/en
Publication of JPS5561032A publication Critical patent/JPS5561032A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Abstract

PURPOSE: To prevent effects of deflection and bending stress on semiconductor element when metal poles are densely inserted and adhered pierced holes made in an Si supporting stand vertically to an adhesion surface of the semiconductor base.
CONSTITUTION: A p+ poly Si is used as a supporting stand 5 and B of 1W5×1020 atoms cm3 is added. Many pierced holes 6, being vertically to an alloy adhesion surface between the stand 5 and an Si base 1, are made, and a vacuum evaporation of Al 7 is applied the inner surface of holes 6. Poles 8 of Mo etc. are inserted densely into the holes 6 and the both surfaces are flated out and adhered. A solder 3 of Al foil and then the Si base 1 are put on and these are soldered each other under vacuum heating, and an Al electrode 4 is set on. With this constitution, deflection of the stand is almost disappeared because the deflections of the poly Si stand and of Mo poles are cancelled out, and as the base is free from any injurious factors, the stable characteristics are obtained.
COPYRIGHT: (C)1980,JPO&Japio
JP13415678A 1978-10-30 1978-10-30 Semiconductor element Pending JPS5561032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13415678A JPS5561032A (en) 1978-10-30 1978-10-30 Semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13415678A JPS5561032A (en) 1978-10-30 1978-10-30 Semiconductor element

Publications (1)

Publication Number Publication Date
JPS5561032A true JPS5561032A (en) 1980-05-08

Family

ID=15121769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13415678A Pending JPS5561032A (en) 1978-10-30 1978-10-30 Semiconductor element

Country Status (1)

Country Link
JP (1) JPS5561032A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device

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