JPS5561032A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS5561032A JPS5561032A JP13415678A JP13415678A JPS5561032A JP S5561032 A JPS5561032 A JP S5561032A JP 13415678 A JP13415678 A JP 13415678A JP 13415678 A JP13415678 A JP 13415678A JP S5561032 A JPS5561032 A JP S5561032A
- Authority
- JP
- Japan
- Prior art keywords
- stand
- base
- holes
- poles
- deflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To prevent effects of deflection and bending stress on semiconductor element when metal poles are densely inserted and adhered pierced holes made in an Si supporting stand vertically to an adhesion surface of the semiconductor base.
CONSTITUTION: A p+ poly Si is used as a supporting stand 5 and B of 1W5×1020 atoms cm3 is added. Many pierced holes 6, being vertically to an alloy adhesion surface between the stand 5 and an Si base 1, are made, and a vacuum evaporation of Al 7 is applied the inner surface of holes 6. Poles 8 of Mo etc. are inserted densely into the holes 6 and the both surfaces are flated out and adhered. A solder 3 of Al foil and then the Si base 1 are put on and these are soldered each other under vacuum heating, and an Al electrode 4 is set on. With this constitution, deflection of the stand is almost disappeared because the deflections of the poly Si stand and of Mo poles are cancelled out, and as the base is free from any injurious factors, the stable characteristics are obtained.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13415678A JPS5561032A (en) | 1978-10-30 | 1978-10-30 | Semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13415678A JPS5561032A (en) | 1978-10-30 | 1978-10-30 | Semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5561032A true JPS5561032A (en) | 1980-05-08 |
Family
ID=15121769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13415678A Pending JPS5561032A (en) | 1978-10-30 | 1978-10-30 | Semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5561032A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4664309A (en) * | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
-
1978
- 1978-10-30 JP JP13415678A patent/JPS5561032A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4664309A (en) * | 1983-06-30 | 1987-05-12 | Raychem Corporation | Chip mounting device |
US4705205A (en) * | 1983-06-30 | 1987-11-10 | Raychem Corporation | Chip carrier mounting device |
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