JPS55532A - Display unit - Google Patents

Display unit

Info

Publication number
JPS55532A
JPS55532A JP7356978A JP7356978A JPS55532A JP S55532 A JPS55532 A JP S55532A JP 7356978 A JP7356978 A JP 7356978A JP 7356978 A JP7356978 A JP 7356978A JP S55532 A JPS55532 A JP S55532A
Authority
JP
Japan
Prior art keywords
display unit
display
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7356978A
Other languages
Japanese (ja)
Inventor
Tatsuhiko Niina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP7356978A priority Critical patent/JPS55532A/en
Publication of JPS55532A publication Critical patent/JPS55532A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP7356978A 1978-06-14 1978-06-14 Display unit Pending JPS55532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7356978A JPS55532A (en) 1978-06-14 1978-06-14 Display unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7356978A JPS55532A (en) 1978-06-14 1978-06-14 Display unit

Publications (1)

Publication Number Publication Date
JPS55532A true JPS55532A (en) 1980-01-05

Family

ID=13522028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7356978A Pending JPS55532A (en) 1978-06-14 1978-06-14 Display unit

Country Status (1)

Country Link
JP (1) JPS55532A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233978A (en) * 1990-02-08 1991-10-17 Matsushita Electric Ind Co Ltd Light emitting device
JP2016503958A (en) * 2012-12-10 2016-02-08 ルクスビュー テクノロジー コーポレイション Light emitting element reflection bank structure
US9559142B2 (en) 2012-12-10 2017-01-31 Apple Inc. Active matrix display panel with ground tie lines
JP2017108105A (en) * 2015-11-30 2017-06-15 日亜化学工業株式会社 Light-emitting device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233978A (en) * 1990-02-08 1991-10-17 Matsushita Electric Ind Co Ltd Light emitting device
JP2016503958A (en) * 2012-12-10 2016-02-08 ルクスビュー テクノロジー コーポレイション Light emitting element reflection bank structure
US9559142B2 (en) 2012-12-10 2017-01-31 Apple Inc. Active matrix display panel with ground tie lines
US9620487B2 (en) 2012-12-10 2017-04-11 Apple Inc. Light emitting device reflective bank structure
US10043784B2 (en) 2012-12-10 2018-08-07 Apple Inc. Light emitting device reflective bank structure
US10784236B2 (en) 2012-12-10 2020-09-22 Apple Inc. Light emitting device reflective bank structure
US11373986B2 (en) 2012-12-10 2022-06-28 Apple Inc. Light emitting device reflective bank structure
US11916048B2 (en) 2012-12-10 2024-02-27 Apple Inc. Light emitting device reflective bank structure
JP2017108105A (en) * 2015-11-30 2017-06-15 日亜化学工業株式会社 Light-emitting device

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