JPS5549775B2 - - Google Patents

Info

Publication number
JPS5549775B2
JPS5549775B2 JP8958275A JP8958275A JPS5549775B2 JP S5549775 B2 JPS5549775 B2 JP S5549775B2 JP 8958275 A JP8958275 A JP 8958275A JP 8958275 A JP8958275 A JP 8958275A JP S5549775 B2 JPS5549775 B2 JP S5549775B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8958275A
Other languages
Japanese (ja)
Other versions
JPS5140077A (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5140077A publication Critical patent/JPS5140077A/ja
Publication of JPS5549775B2 publication Critical patent/JPS5549775B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/00

Landscapes

  • Die Bonding (AREA)
JP8958275A 1974-07-24 1975-07-22 Expired JPS5549775B2 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2435637A DE2435637C3 (de) 1974-07-24 1974-07-24 Halbleiteranordnung mit Druckkontakt

Publications (2)

Publication Number Publication Date
JPS5140077A JPS5140077A (en:Method) 1976-04-03
JPS5549775B2 true JPS5549775B2 (en:Method) 1980-12-13

Family

ID=5921414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8958275A Expired JPS5549775B2 (en:Method) 1974-07-24 1975-07-22

Country Status (8)

Country Link
US (1) US4008487A (en:Method)
JP (1) JPS5549775B2 (en:Method)
CA (1) CA1026014A (en:Method)
DE (1) DE2435637C3 (en:Method)
ES (1) ES439672A1 (en:Method)
FR (1) FR2280204A1 (en:Method)
GB (1) GB1479112A (en:Method)
IT (1) IT1039916B (en:Method)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51110552A (en) * 1975-03-26 1976-09-30 Okayasu Shoten Kk 244 mechirenshikuroarutanooru oyobi sonoketsugotaikarashikuropuranooru oyobi sonoketsugotainojudoho
JPS51141859A (en) * 1975-06-03 1976-12-07 Kanemi Soko Kk Process for preparing cyclopranol
US4093958A (en) * 1976-12-09 1978-06-06 Motorola, Inc. Semiconductor device assembly with improved fatigue resistance
US4118249A (en) * 1977-08-30 1978-10-03 The United States Of America As Represented By The United States Department Of Energy Modular assembly of a photovoltaic solar energy receiver
JPS5812280B2 (ja) * 1979-06-06 1983-03-07 天野製薬株式会社 シクロブラノ−ル又はその有機酸エステルの製造方法
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
US4654754A (en) * 1982-11-02 1987-03-31 Fairchild Weston Systems, Inc. Thermal link
GB2164213B (en) * 1984-09-06 1988-07-13 Nec Corp Structure for connecting leadless chip carrier
EP0216090A1 (de) * 1985-08-30 1987-04-01 Siemens Aktiengesellschaft Gehäuse für ein im Betrieb Verlustwärme abgebendes Schaltungsbauteil
US4899255A (en) * 1988-07-25 1990-02-06 Motorola Inc. Heat sink clip and assembly and method of manufacture

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2889498A (en) * 1955-11-08 1959-06-02 Westinghouse Electric Corp Semiconductor rectifier assembly
JPS455387Y1 (en:Method) * 1966-11-10 1970-03-14
JPS4728728U (en:Method) * 1971-04-22 1972-12-01
JPS5215676Y2 (en:Method) * 1971-08-05 1977-04-08
JPS4857524U (en:Method) * 1971-11-08 1973-07-23

Also Published As

Publication number Publication date
ES439672A1 (es) 1977-03-16
DE2435637A1 (de) 1976-02-05
DE2435637C3 (de) 1979-04-05
IT1039916B (it) 1979-12-10
US4008487A (en) 1977-02-15
JPS5140077A (en:Method) 1976-04-03
CA1026014A (en) 1978-02-07
FR2280204A1 (fr) 1976-02-20
GB1479112A (en) 1977-07-06
DE2435637B2 (de) 1978-07-27

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