JPS5547726U - - Google Patents
Info
- Publication number
- JPS5547726U JPS5547726U JP12978278U JP12978278U JPS5547726U JP S5547726 U JPS5547726 U JP S5547726U JP 12978278 U JP12978278 U JP 12978278U JP 12978278 U JP12978278 U JP 12978278U JP S5547726 U JPS5547726 U JP S5547726U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978129782U JPS5824438Y2 (ja) | 1978-09-20 | 1978-09-20 | ワイヤボンダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978129782U JPS5824438Y2 (ja) | 1978-09-20 | 1978-09-20 | ワイヤボンダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5547726U true JPS5547726U (OSRAM) | 1980-03-28 |
| JPS5824438Y2 JPS5824438Y2 (ja) | 1983-05-25 |
Family
ID=29094771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978129782U Expired JPS5824438Y2 (ja) | 1978-09-20 | 1978-09-20 | ワイヤボンダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5824438Y2 (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63191927A (ja) * | 1987-01-21 | 1988-08-09 | シーメンス、アクチエンゲゼルシヤフト | ボンデイング工程中のボンデイングパラメータ監視装置 |
-
1978
- 1978-09-20 JP JP1978129782U patent/JPS5824438Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63191927A (ja) * | 1987-01-21 | 1988-08-09 | シーメンス、アクチエンゲゼルシヤフト | ボンデイング工程中のボンデイングパラメータ監視装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5824438Y2 (ja) | 1983-05-25 |