JPS5547376A - Partially plating method for molded product of resin - Google Patents

Partially plating method for molded product of resin

Info

Publication number
JPS5547376A
JPS5547376A JP11894278A JP11894278A JPS5547376A JP S5547376 A JPS5547376 A JP S5547376A JP 11894278 A JP11894278 A JP 11894278A JP 11894278 A JP11894278 A JP 11894278A JP S5547376 A JPS5547376 A JP S5547376A
Authority
JP
Japan
Prior art keywords
resin
molded
abs resin
plating
molding machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11894278A
Other languages
Japanese (ja)
Inventor
Takao Owada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOYO TERUMII KK
Original Assignee
TOYO TERUMII KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOYO TERUMII KK filed Critical TOYO TERUMII KK
Priority to JP11894278A priority Critical patent/JPS5547376A/en
Publication of JPS5547376A publication Critical patent/JPS5547376A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To manufacture a cmposite molded product of resins which has no thin stripes at the border between the resins, and has large difference in sensibility to plating, by molding the ABS resin with high impact styrene resin (HI resin) in such a manner that the ABS resin comes to the surface. CONSTITUTION:An HI resin such as a copolymer etc. which is made by the graft polymerization of styrene monomer with butadiene-styrene comonomer, and ABS resin are molded in the following way: The HI resin and ABS resin are molded using an injection molding machine for double molding, e.g., a multiple color, simultaneous molding machine, or a usual injection molding machine to form a composite molded resin in which ABS resin comes to the surface at portions which are to be plated partially. Then the composite molded resin is pretreated especially with high- chromium etching soln., then subjected to electroless plateing, electolytic plating by usual method to conduct partial plating.
JP11894278A 1978-09-27 1978-09-27 Partially plating method for molded product of resin Pending JPS5547376A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11894278A JPS5547376A (en) 1978-09-27 1978-09-27 Partially plating method for molded product of resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11894278A JPS5547376A (en) 1978-09-27 1978-09-27 Partially plating method for molded product of resin

Publications (1)

Publication Number Publication Date
JPS5547376A true JPS5547376A (en) 1980-04-03

Family

ID=14749042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11894278A Pending JPS5547376A (en) 1978-09-27 1978-09-27 Partially plating method for molded product of resin

Country Status (1)

Country Link
JP (1) JPS5547376A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827917A (en) * 1971-08-13 1973-04-13
JPS4828357A (en) * 1971-08-05 1973-04-14
JPS4930273A (en) * 1972-07-20 1974-03-18

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828357A (en) * 1971-08-05 1973-04-14
JPS4827917A (en) * 1971-08-13 1973-04-13
JPS4930273A (en) * 1972-07-20 1974-03-18

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