JPS5545214U - - Google Patents
Info
- Publication number
- JPS5545214U JPS5545214U JP1978126742U JP12674278U JPS5545214U JP S5545214 U JPS5545214 U JP S5545214U JP 1978126742 U JP1978126742 U JP 1978126742U JP 12674278 U JP12674278 U JP 12674278U JP S5545214 U JPS5545214 U JP S5545214U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978126742U JPS5749388Y2 (https=) | 1978-09-14 | 1978-09-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978126742U JPS5749388Y2 (https=) | 1978-09-14 | 1978-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5545214U true JPS5545214U (https=) | 1980-03-25 |
| JPS5749388Y2 JPS5749388Y2 (https=) | 1982-10-29 |
Family
ID=29088857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978126742U Expired JPS5749388Y2 (https=) | 1978-09-14 | 1978-09-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5749388Y2 (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5114316A (https=) * | 1974-06-28 | 1976-02-04 | Oce Van Der Grinten Nv | |
| JPS5785133U (https=) * | 1980-11-14 | 1982-05-26 | ||
| JPS5796538A (en) * | 1980-12-08 | 1982-06-15 | Toshiba Corp | Processing method for component parts of semiconductor device |
| JPH01179336A (ja) * | 1987-12-30 | 1989-07-17 | Sanken Electric Co Ltd | ワイヤボンディング装置 |
-
1978
- 1978-09-14 JP JP1978126742U patent/JPS5749388Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5114316A (https=) * | 1974-06-28 | 1976-02-04 | Oce Van Der Grinten Nv | |
| JPS5785133U (https=) * | 1980-11-14 | 1982-05-26 | ||
| JPS5796538A (en) * | 1980-12-08 | 1982-06-15 | Toshiba Corp | Processing method for component parts of semiconductor device |
| JPH01179336A (ja) * | 1987-12-30 | 1989-07-17 | Sanken Electric Co Ltd | ワイヤボンディング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5749388Y2 (https=) | 1982-10-29 |