JPS5544737Y2 - - Google Patents
Info
- Publication number
- JPS5544737Y2 JPS5544737Y2 JP6070775U JP6070775U JPS5544737Y2 JP S5544737 Y2 JPS5544737 Y2 JP S5544737Y2 JP 6070775 U JP6070775 U JP 6070775U JP 6070775 U JP6070775 U JP 6070775U JP S5544737 Y2 JPS5544737 Y2 JP S5544737Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cartons (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6070775U JPS5544737Y2 (en:Method) | 1975-05-07 | 1975-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6070775U JPS5544737Y2 (en:Method) | 1975-05-07 | 1975-05-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51141633U JPS51141633U (en:Method) | 1976-11-15 |
| JPS5544737Y2 true JPS5544737Y2 (en:Method) | 1980-10-21 |
Family
ID=28521459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6070775U Expired JPS5544737Y2 (en:Method) | 1975-05-07 | 1975-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5544737Y2 (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8884424B2 (en) | 2010-01-13 | 2014-11-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9349611B2 (en) | 2010-03-22 | 2016-05-24 | Advanced Semiconductor Engineering, Inc. | Stackable semiconductor package and manufacturing method thereof |
| US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
-
1975
- 1975-05-07 JP JP6070775U patent/JPS5544737Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8884424B2 (en) | 2010-01-13 | 2014-11-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9196597B2 (en) | 2010-01-13 | 2015-11-24 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
| US9349611B2 (en) | 2010-03-22 | 2016-05-24 | Advanced Semiconductor Engineering, Inc. | Stackable semiconductor package and manufacturing method thereof |
| US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51141633U (en:Method) | 1976-11-15 |