JPS5544737Y2 - - Google Patents

Info

Publication number
JPS5544737Y2
JPS5544737Y2 JP6070775U JP6070775U JPS5544737Y2 JP S5544737 Y2 JPS5544737 Y2 JP S5544737Y2 JP 6070775 U JP6070775 U JP 6070775U JP 6070775 U JP6070775 U JP 6070775U JP S5544737 Y2 JPS5544737 Y2 JP S5544737Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6070775U
Other versions
JPS51141633U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6070775U priority Critical patent/JPS5544737Y2/ja
Publication of JPS51141633U publication Critical patent/JPS51141633U/ja
Application granted granted Critical
Publication of JPS5544737Y2 publication Critical patent/JPS5544737Y2/ja
Expired legal-status Critical Current

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  • Cartons (AREA)
JP6070775U 1975-05-07 1975-05-07 Expired JPS5544737Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6070775U JPS5544737Y2 (ja) 1975-05-07 1975-05-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6070775U JPS5544737Y2 (ja) 1975-05-07 1975-05-07

Publications (2)

Publication Number Publication Date
JPS51141633U JPS51141633U (ja) 1976-11-15
JPS5544737Y2 true JPS5544737Y2 (ja) 1980-10-21

Family

ID=28521459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6070775U Expired JPS5544737Y2 (ja) 1975-05-07 1975-05-07

Country Status (1)

Country Link
JP (1) JPS5544737Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8884424B2 (en) 2010-01-13 2014-11-11 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US9349611B2 (en) 2010-03-22 2016-05-24 Advanced Semiconductor Engineering, Inc. Stackable semiconductor package and manufacturing method thereof
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8884424B2 (en) 2010-01-13 2014-11-11 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US9196597B2 (en) 2010-01-13 2015-11-24 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
US9349611B2 (en) 2010-03-22 2016-05-24 Advanced Semiconductor Engineering, Inc. Stackable semiconductor package and manufacturing method thereof
US9406658B2 (en) 2010-12-17 2016-08-02 Advanced Semiconductor Engineering, Inc. Embedded component device and manufacturing methods thereof

Also Published As

Publication number Publication date
JPS51141633U (ja) 1976-11-15

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