JPS5544477B2 - - Google Patents
Info
- Publication number
- JPS5544477B2 JPS5544477B2 JP2157176A JP2157176A JPS5544477B2 JP S5544477 B2 JPS5544477 B2 JP S5544477B2 JP 2157176 A JP2157176 A JP 2157176A JP 2157176 A JP2157176 A JP 2157176A JP S5544477 B2 JPS5544477 B2 JP S5544477B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2157176A JPS52103677A (en) | 1976-02-25 | 1976-02-25 | Method of sealing hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2157176A JPS52103677A (en) | 1976-02-25 | 1976-02-25 | Method of sealing hybrid integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52103677A JPS52103677A (en) | 1977-08-31 |
JPS5544477B2 true JPS5544477B2 (en) | 1980-11-12 |
Family
ID=12058703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2157176A Granted JPS52103677A (en) | 1976-02-25 | 1976-02-25 | Method of sealing hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52103677A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57146255U (en) * | 1981-03-06 | 1982-09-14 | ||
JPS5823340A (en) * | 1981-08-04 | 1983-02-12 | Sanyo Electric Co Ltd | Tape tension controller |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57210645A (en) * | 1981-06-19 | 1982-12-24 | Toshiba Corp | Hybrid integrated circuit module and manufacture thereof |
JPS59146954U (en) * | 1983-03-22 | 1984-10-01 | 三洋電機株式会社 | Sealing structure of hybrid integrated circuit |
US7130198B2 (en) * | 2001-12-06 | 2006-10-31 | Rohm Co., Ltd. | Resin-packaged protection circuit module for rechargeable batteries and method of making the same |
JP6323066B2 (en) * | 2013-03-29 | 2018-05-16 | オムロン株式会社 | Electronics |
-
1976
- 1976-02-25 JP JP2157176A patent/JPS52103677A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57146255U (en) * | 1981-03-06 | 1982-09-14 | ||
JPS5823340A (en) * | 1981-08-04 | 1983-02-12 | Sanyo Electric Co Ltd | Tape tension controller |
Also Published As
Publication number | Publication date |
---|---|
JPS52103677A (en) | 1977-08-31 |