JPS5544477B2 - - Google Patents

Info

Publication number
JPS5544477B2
JPS5544477B2 JP2157176A JP2157176A JPS5544477B2 JP S5544477 B2 JPS5544477 B2 JP S5544477B2 JP 2157176 A JP2157176 A JP 2157176A JP 2157176 A JP2157176 A JP 2157176A JP S5544477 B2 JPS5544477 B2 JP S5544477B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2157176A
Other languages
Japanese (ja)
Other versions
JPS52103677A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2157176A priority Critical patent/JPS52103677A/en
Publication of JPS52103677A publication Critical patent/JPS52103677A/en
Publication of JPS5544477B2 publication Critical patent/JPS5544477B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2157176A 1976-02-25 1976-02-25 Method of sealing hybrid integrated circuit Granted JPS52103677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2157176A JPS52103677A (en) 1976-02-25 1976-02-25 Method of sealing hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2157176A JPS52103677A (en) 1976-02-25 1976-02-25 Method of sealing hybrid integrated circuit

Publications (2)

Publication Number Publication Date
JPS52103677A JPS52103677A (en) 1977-08-31
JPS5544477B2 true JPS5544477B2 (en) 1980-11-12

Family

ID=12058703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2157176A Granted JPS52103677A (en) 1976-02-25 1976-02-25 Method of sealing hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS52103677A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57146255U (en) * 1981-03-06 1982-09-14
JPS5823340A (en) * 1981-08-04 1983-02-12 Sanyo Electric Co Ltd Tape tension controller

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210645A (en) * 1981-06-19 1982-12-24 Toshiba Corp Hybrid integrated circuit module and manufacture thereof
JPS59146954U (en) * 1983-03-22 1984-10-01 三洋電機株式会社 Sealing structure of hybrid integrated circuit
US7130198B2 (en) * 2001-12-06 2006-10-31 Rohm Co., Ltd. Resin-packaged protection circuit module for rechargeable batteries and method of making the same
JP6323066B2 (en) * 2013-03-29 2018-05-16 オムロン株式会社 Electronics

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57146255U (en) * 1981-03-06 1982-09-14
JPS5823340A (en) * 1981-08-04 1983-02-12 Sanyo Electric Co Ltd Tape tension controller

Also Published As

Publication number Publication date
JPS52103677A (en) 1977-08-31

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