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Filing date
Publication date
Application filedfiledCritical
Priority to JP50043697ApriorityCriticalpatent/JPS51118372A/ja
Publication of JPS51118372ApublicationCriticalpatent/JPS51118372A/ja
Publication of JPS5543609B2publicationCriticalpatent/JPS5543609B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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Engineering & Computer Science
(AREA)
Computer Hardware Design
(AREA)
Microelectronics & Electronic Packaging
(AREA)
Power Engineering
(AREA)
Wire Bonding
(AREA)
Die Bonding
(AREA)
JP50043697A1975-04-101975-04-10Solder for semiconductor unit
GrantedJPS51118372A
(en)