JPS5542326U - - Google Patents

Info

Publication number
JPS5542326U
JPS5542326U JP12497278U JP12497278U JPS5542326U JP S5542326 U JPS5542326 U JP S5542326U JP 12497278 U JP12497278 U JP 12497278U JP 12497278 U JP12497278 U JP 12497278U JP S5542326 U JPS5542326 U JP S5542326U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12497278U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12497278U priority Critical patent/JPS5542326U/ja
Publication of JPS5542326U publication Critical patent/JPS5542326U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Die Bonding (AREA)
JP12497278U 1978-09-12 1978-09-12 Pending JPS5542326U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12497278U JPS5542326U (ja) 1978-09-12 1978-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12497278U JPS5542326U (ja) 1978-09-12 1978-09-12

Publications (1)

Publication Number Publication Date
JPS5542326U true JPS5542326U (ja) 1980-03-18

Family

ID=29085459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12497278U Pending JPS5542326U (ja) 1978-09-12 1978-09-12

Country Status (1)

Country Link
JP (1) JPS5542326U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106471A (ja) * 1983-11-15 1985-06-11 住友ゴム工業株式会社 テニスボ−ル用コア
JPS60136331A (ja) * 1983-12-19 1985-07-19 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション ダイシング用フィルムから半導体チップの取外方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60106471A (ja) * 1983-11-15 1985-06-11 住友ゴム工業株式会社 テニスボ−ル用コア
JPS60136331A (ja) * 1983-12-19 1985-07-19 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション ダイシング用フィルムから半導体チップの取外方法

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