JPS5540523U - - Google Patents
Info
- Publication number
- JPS5540523U JPS5540523U JP12203878U JP12203878U JPS5540523U JP S5540523 U JPS5540523 U JP S5540523U JP 12203878 U JP12203878 U JP 12203878U JP 12203878 U JP12203878 U JP 12203878U JP S5540523 U JPS5540523 U JP S5540523U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12203878U JPS5540523U (ja) | 1978-09-04 | 1978-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12203878U JPS5540523U (ja) | 1978-09-04 | 1978-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5540523U true JPS5540523U (ja) | 1980-03-15 |
Family
ID=29079773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12203878U Pending JPS5540523U (ja) | 1978-09-04 | 1978-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5540523U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6224655A (ja) * | 1985-07-24 | 1987-02-02 | Toshiba Corp | リ−ドフレ−ム |
-
1978
- 1978-09-04 JP JP12203878U patent/JPS5540523U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6224655A (ja) * | 1985-07-24 | 1987-02-02 | Toshiba Corp | リ−ドフレ−ム |