JPS5538057B2 - - Google Patents

Info

Publication number
JPS5538057B2
JPS5538057B2 JP8085676A JP8085676A JPS5538057B2 JP S5538057 B2 JPS5538057 B2 JP S5538057B2 JP 8085676 A JP8085676 A JP 8085676A JP 8085676 A JP8085676 A JP 8085676A JP S5538057 B2 JPS5538057 B2 JP S5538057B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8085676A
Other versions
JPS537173A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8085676A priority Critical patent/JPS537173A/ja
Publication of JPS537173A publication Critical patent/JPS537173A/ja
Publication of JPS5538057B2 publication Critical patent/JPS5538057B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Casings For Electric Apparatus (AREA)
JP8085676A 1976-07-09 1976-07-09 Solder-sealed ceramic package Granted JPS537173A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8085676A JPS537173A (en) 1976-07-09 1976-07-09 Solder-sealed ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8085676A JPS537173A (en) 1976-07-09 1976-07-09 Solder-sealed ceramic package

Publications (2)

Publication Number Publication Date
JPS537173A JPS537173A (en) 1978-01-23
JPS5538057B2 true JPS5538057B2 (ja) 1980-10-02

Family

ID=13729977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8085676A Granted JPS537173A (en) 1976-07-09 1976-07-09 Solder-sealed ceramic package

Country Status (1)

Country Link
JP (1) JPS537173A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142916U (ja) * 1985-02-25 1986-09-03

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5852858A (ja) * 1981-09-24 1983-03-29 Nec Corp 半導体装置
JP2007202095A (ja) * 2005-12-28 2007-08-09 Kyocera Kinseki Corp 圧電デバイス

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831511A (ja) * 1971-08-26 1973-04-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831511A (ja) * 1971-08-26 1973-04-25

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142916U (ja) * 1985-02-25 1986-09-03

Also Published As

Publication number Publication date
JPS537173A (en) 1978-01-23

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