JPS5537868B2 - - Google Patents
Info
- Publication number
- JPS5537868B2 JPS5537868B2 JP12558073A JP12558073A JPS5537868B2 JP S5537868 B2 JPS5537868 B2 JP S5537868B2 JP 12558073 A JP12558073 A JP 12558073A JP 12558073 A JP12558073 A JP 12558073A JP S5537868 B2 JPS5537868 B2 JP S5537868B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7239747A FR2205800B1 (en:Method) | 1972-11-09 | 1972-11-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49133867A JPS49133867A (en:Method) | 1974-12-23 |
| JPS5537868B2 true JPS5537868B2 (en:Method) | 1980-09-30 |
Family
ID=9106908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12558073A Expired JPS5537868B2 (en:Method) | 1972-11-09 | 1973-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5537868B2 (en:Method) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS609343B2 (ja) * | 1974-10-18 | 1985-03-09 | 日本電気株式会社 | 電子部品製造法 |
| JPS5481070A (en) * | 1977-12-12 | 1979-06-28 | Fujitsu Ltd | Carrier semiconductor device |
| US4835847A (en) * | 1988-04-20 | 1989-06-06 | International Business Machines Corp. | Method and apparatus for mounting a flexible film electronic device carrier on a substrate |
-
1973
- 1973-11-09 JP JP12558073A patent/JPS5537868B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49133867A (en:Method) | 1974-12-23 |