JPS5537868B2 - - Google Patents

Info

Publication number
JPS5537868B2
JPS5537868B2 JP12558073A JP12558073A JPS5537868B2 JP S5537868 B2 JPS5537868 B2 JP S5537868B2 JP 12558073 A JP12558073 A JP 12558073A JP 12558073 A JP12558073 A JP 12558073A JP S5537868 B2 JPS5537868 B2 JP S5537868B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12558073A
Other languages
Japanese (ja)
Other versions
JPS49133867A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR7239747A external-priority patent/FR2205800B1/fr
Application filed filed Critical
Publication of JPS49133867A publication Critical patent/JPS49133867A/ja
Publication of JPS5537868B2 publication Critical patent/JPS5537868B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP12558073A 1972-11-09 1973-11-09 Expired JPS5537868B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7239747A FR2205800B1 (enrdf_load_stackoverflow) 1972-11-09 1972-11-09

Publications (2)

Publication Number Publication Date
JPS49133867A JPS49133867A (enrdf_load_stackoverflow) 1974-12-23
JPS5537868B2 true JPS5537868B2 (enrdf_load_stackoverflow) 1980-09-30

Family

ID=9106908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12558073A Expired JPS5537868B2 (enrdf_load_stackoverflow) 1972-11-09 1973-11-09

Country Status (1)

Country Link
JP (1) JPS5537868B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609343B2 (ja) * 1974-10-18 1985-03-09 日本電気株式会社 電子部品製造法
JPS5481070A (en) * 1977-12-12 1979-06-28 Fujitsu Ltd Carrier semiconductor device
US4835847A (en) * 1988-04-20 1989-06-06 International Business Machines Corp. Method and apparatus for mounting a flexible film electronic device carrier on a substrate

Also Published As

Publication number Publication date
JPS49133867A (enrdf_load_stackoverflow) 1974-12-23

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