JPS5537858B2 - - Google Patents
Info
- Publication number
- JPS5537858B2 JPS5537858B2 JP7059475A JP7059475A JPS5537858B2 JP S5537858 B2 JPS5537858 B2 JP S5537858B2 JP 7059475 A JP7059475 A JP 7059475A JP 7059475 A JP7059475 A JP 7059475A JP S5537858 B2 JPS5537858 B2 JP S5537858B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50070594A JPS51147176A (en) | 1975-06-11 | 1975-06-11 | Method of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50070594A JPS51147176A (en) | 1975-06-11 | 1975-06-11 | Method of semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51147176A JPS51147176A (en) | 1976-12-17 |
| JPS5537858B2 true JPS5537858B2 (enrdf_load_stackoverflow) | 1980-09-30 |
Family
ID=13436029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50070594A Granted JPS51147176A (en) | 1975-06-11 | 1975-06-11 | Method of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51147176A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58212150A (ja) * | 1982-06-02 | 1983-12-09 | Mitsubishi Metal Corp | 半導体装置封止用蓋材 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4837223A (enrdf_load_stackoverflow) * | 1971-09-13 | 1973-06-01 |
-
1975
- 1975-06-11 JP JP50070594A patent/JPS51147176A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51147176A (en) | 1976-12-17 |