JPS5537856B2 - - Google Patents
Info
- Publication number
- JPS5537856B2 JPS5537856B2 JP2321473A JP2321473A JPS5537856B2 JP S5537856 B2 JPS5537856 B2 JP S5537856B2 JP 2321473 A JP2321473 A JP 2321473A JP 2321473 A JP2321473 A JP 2321473A JP S5537856 B2 JPS5537856 B2 JP S5537856B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2321473A JPS5537856B2 (https=) | 1973-02-28 | 1973-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2321473A JPS5537856B2 (https=) | 1973-02-28 | 1973-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49114363A JPS49114363A (https=) | 1974-10-31 |
| JPS5537856B2 true JPS5537856B2 (https=) | 1980-09-30 |
Family
ID=12104399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2321473A Expired JPS5537856B2 (https=) | 1973-02-28 | 1973-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5537856B2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587412U (ja) * | 1981-07-07 | 1983-01-18 | マスプロ電工株式会社 | 同軸ケ−ブル |
| JPS5875755U (ja) * | 1981-11-16 | 1983-05-21 | 丸昌工業株式会社 | 自動浸漬装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5627941A (en) * | 1979-08-17 | 1981-03-18 | Hitachi Ltd | Manufacture of semiconductor device |
| US4832996A (en) * | 1988-02-24 | 1989-05-23 | Motorola, Inc. | Semiconductor die for plastic encapsulation having an adhesion promoter |
| WO2026004709A1 (ja) * | 2024-06-25 | 2026-01-02 | ローム株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5025734U (https=) * | 1973-07-09 | 1975-03-25 |
-
1973
- 1973-02-28 JP JP2321473A patent/JPS5537856B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587412U (ja) * | 1981-07-07 | 1983-01-18 | マスプロ電工株式会社 | 同軸ケ−ブル |
| JPS5875755U (ja) * | 1981-11-16 | 1983-05-21 | 丸昌工業株式会社 | 自動浸漬装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49114363A (https=) | 1974-10-31 |