JPS49114363A - - Google Patents

Info

Publication number
JPS49114363A
JPS49114363A JP48023214A JP2321473A JPS49114363A JP S49114363 A JPS49114363 A JP S49114363A JP 48023214 A JP48023214 A JP 48023214A JP 2321473 A JP2321473 A JP 2321473A JP S49114363 A JPS49114363 A JP S49114363A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48023214A
Other languages
Japanese (ja)
Other versions
JPS5537856B2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2321473A priority Critical patent/JPS5537856B2/ja
Publication of JPS49114363A publication Critical patent/JPS49114363A/ja
Publication of JPS5537856B2 publication Critical patent/JPS5537856B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2321473A 1973-02-28 1973-02-28 Expired JPS5537856B2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2321473A JPS5537856B2 (https=) 1973-02-28 1973-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2321473A JPS5537856B2 (https=) 1973-02-28 1973-02-28

Publications (2)

Publication Number Publication Date
JPS49114363A true JPS49114363A (https=) 1974-10-31
JPS5537856B2 JPS5537856B2 (https=) 1980-09-30

Family

ID=12104399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2321473A Expired JPS5537856B2 (https=) 1973-02-28 1973-02-28

Country Status (1)

Country Link
JP (1) JPS5537856B2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627941A (en) * 1979-08-17 1981-03-18 Hitachi Ltd Manufacture of semiconductor device
JPH027549A (ja) * 1988-02-24 1990-01-11 Motorola Inc 接着増進剤を有するプラスチック封止用半導体ダイ
WO2026004709A1 (ja) * 2024-06-25 2026-01-02 ローム株式会社 半導体装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587412U (ja) * 1981-07-07 1983-01-18 マスプロ電工株式会社 同軸ケ−ブル
JPS5875755U (ja) * 1981-11-16 1983-05-21 丸昌工業株式会社 自動浸漬装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025734U (https=) * 1973-07-09 1975-03-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025734U (https=) * 1973-07-09 1975-03-25

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5627941A (en) * 1979-08-17 1981-03-18 Hitachi Ltd Manufacture of semiconductor device
JPH027549A (ja) * 1988-02-24 1990-01-11 Motorola Inc 接着増進剤を有するプラスチック封止用半導体ダイ
WO2026004709A1 (ja) * 2024-06-25 2026-01-02 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
JPS5537856B2 (https=) 1980-09-30

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