JPS5536213A - Impurity extraction from thermosetting resin - Google Patents
Impurity extraction from thermosetting resinInfo
- Publication number
- JPS5536213A JPS5536213A JP10855178A JP10855178A JPS5536213A JP S5536213 A JPS5536213 A JP S5536213A JP 10855178 A JP10855178 A JP 10855178A JP 10855178 A JP10855178 A JP 10855178A JP S5536213 A JPS5536213 A JP S5536213A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- water
- powder
- high pressure
- extract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
PURPOSE: To extract and remove water-soluble impurities from the title resin and to improve the electrical properties, by pulverizing the resin for sealing semiconductor elements, and by bringing the powder into contact with hot water under the molding conditions at a high pressure.
CONSTITUTION: A sealing resin, e.g. epoxy or silicone, is pressed and cured at a molding temperature of 140W200°C and pulverized. The powder thus obtained is brought into contact with hot water at 140W200°C under a high pressure of 4W20 kg/cm2 for several to several decades of minutes to extract water-soluble impurities. The extraction conditions can be achieved by controlling the volume of the enclosed vessel, amount of water, and, if necessary, compressed gas e.g. compressed air.
EFFECT: Impruities can be extracted with sensitivity of several decades of ppbs to ppms, and the quality of the resin can be evaluated accurately by the amounts of impurities and electrical conductivity.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10855178A JPS5536213A (en) | 1978-09-06 | 1978-09-06 | Impurity extraction from thermosetting resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10855178A JPS5536213A (en) | 1978-09-06 | 1978-09-06 | Impurity extraction from thermosetting resin |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5536213A true JPS5536213A (en) | 1980-03-13 |
Family
ID=14487697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10855178A Pending JPS5536213A (en) | 1978-09-06 | 1978-09-06 | Impurity extraction from thermosetting resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5536213A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011043803A1 (en) * | 2009-10-07 | 2011-04-14 | Dow Global Technologies Inc. | Reducing impurities in solid epoxy resin |
-
1978
- 1978-09-06 JP JP10855178A patent/JPS5536213A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011043803A1 (en) * | 2009-10-07 | 2011-04-14 | Dow Global Technologies Inc. | Reducing impurities in solid epoxy resin |
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