JPS5536213A - Impurity extraction from thermosetting resin - Google Patents

Impurity extraction from thermosetting resin

Info

Publication number
JPS5536213A
JPS5536213A JP10855178A JP10855178A JPS5536213A JP S5536213 A JPS5536213 A JP S5536213A JP 10855178 A JP10855178 A JP 10855178A JP 10855178 A JP10855178 A JP 10855178A JP S5536213 A JPS5536213 A JP S5536213A
Authority
JP
Japan
Prior art keywords
resin
water
powder
high pressure
extract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10855178A
Other languages
Japanese (ja)
Inventor
Kazuhide Sato
Yukio Kamishiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10855178A priority Critical patent/JPS5536213A/en
Publication of JPS5536213A publication Critical patent/JPS5536213A/en
Pending legal-status Critical Current

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  • Processes Of Treating Macromolecular Substances (AREA)

Abstract

PURPOSE: To extract and remove water-soluble impurities from the title resin and to improve the electrical properties, by pulverizing the resin for sealing semiconductor elements, and by bringing the powder into contact with hot water under the molding conditions at a high pressure.
CONSTITUTION: A sealing resin, e.g. epoxy or silicone, is pressed and cured at a molding temperature of 140W200°C and pulverized. The powder thus obtained is brought into contact with hot water at 140W200°C under a high pressure of 4W20 kg/cm2 for several to several decades of minutes to extract water-soluble impurities. The extraction conditions can be achieved by controlling the volume of the enclosed vessel, amount of water, and, if necessary, compressed gas e.g. compressed air.
EFFECT: Impruities can be extracted with sensitivity of several decades of ppbs to ppms, and the quality of the resin can be evaluated accurately by the amounts of impurities and electrical conductivity.
COPYRIGHT: (C)1980,JPO&Japio
JP10855178A 1978-09-06 1978-09-06 Impurity extraction from thermosetting resin Pending JPS5536213A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10855178A JPS5536213A (en) 1978-09-06 1978-09-06 Impurity extraction from thermosetting resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10855178A JPS5536213A (en) 1978-09-06 1978-09-06 Impurity extraction from thermosetting resin

Publications (1)

Publication Number Publication Date
JPS5536213A true JPS5536213A (en) 1980-03-13

Family

ID=14487697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10855178A Pending JPS5536213A (en) 1978-09-06 1978-09-06 Impurity extraction from thermosetting resin

Country Status (1)

Country Link
JP (1) JPS5536213A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043803A1 (en) * 2009-10-07 2011-04-14 Dow Global Technologies Inc. Reducing impurities in solid epoxy resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043803A1 (en) * 2009-10-07 2011-04-14 Dow Global Technologies Inc. Reducing impurities in solid epoxy resin

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