JPS5535843B2 - - Google Patents
Info
- Publication number
- JPS5535843B2 JPS5535843B2 JP732761A JP276173A JPS5535843B2 JP S5535843 B2 JPS5535843 B2 JP S5535843B2 JP 732761 A JP732761 A JP 732761A JP 276173 A JP276173 A JP 276173A JP S5535843 B2 JPS5535843 B2 JP S5535843B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0284—Paper, e.g. as reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49101—Applying terminal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Adjustable Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP732761A JPS5535843B2 (US07935154-20110503-C00006.png) | 1972-12-28 | 1972-12-28 | |
DE2364520A DE2364520C3 (de) | 1972-12-28 | 1973-12-24 | Verfahren zur Herstellung einer gedruckten Schaltung |
US05/734,469 US4087779A (en) | 1972-12-28 | 1976-10-21 | Printed circuit and method of making |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP732761A JPS5535843B2 (US07935154-20110503-C00006.png) | 1972-12-28 | 1972-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4989148A JPS4989148A (US07935154-20110503-C00006.png) | 1974-08-26 |
JPS5535843B2 true JPS5535843B2 (US07935154-20110503-C00006.png) | 1980-09-17 |
Family
ID=11538307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP732761A Expired JPS5535843B2 (US07935154-20110503-C00006.png) | 1972-12-28 | 1972-12-28 |
Country Status (3)
Country | Link |
---|---|
US (1) | US4087779A (US07935154-20110503-C00006.png) |
JP (1) | JPS5535843B2 (US07935154-20110503-C00006.png) |
DE (1) | DE2364520C3 (US07935154-20110503-C00006.png) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2748271C3 (de) * | 1977-10-27 | 1981-07-16 | Wilhelm Ruf KG, 8000 München | Gedruckte Leiterplatte und Verfahren zur Herstellung derselben |
DE2803762A1 (de) * | 1978-01-28 | 1979-08-02 | Licentia Gmbh | Verfahren zur additiven nasschemischen herstellung von schaltungsnetzwerken |
JPS6048201U (ja) * | 1983-09-09 | 1985-04-04 | ティーディーケイ株式会社 | 正特性サ−ミスタ装置 |
FR2568082B1 (fr) * | 1984-07-23 | 1993-08-13 | Constr Telephoniques | Procede pour la realisation de zones de dissipation thermique. |
JPS63205991A (ja) * | 1987-02-23 | 1988-08-25 | 株式会社日立製作所 | 回路基板 |
JPH0263101A (ja) * | 1988-08-29 | 1990-03-02 | Murata Mfg Co Ltd | 可変抵抗器 |
JPH03211802A (ja) * | 1990-01-17 | 1991-09-17 | Aisin Seiki Co Ltd | スイッチ付可変抵抗器 |
DE9102576U1 (de) * | 1991-03-05 | 1991-05-23 | Hella KG Hueck & Co, 4780 Lippstadt | Widerstands-/Sensoranordnung |
DE4332282A1 (de) * | 1993-09-23 | 1995-03-30 | Sel Alcatel Ag | Verfahren zur Herstellung von gedruckten Schaltungen |
DE4408441A1 (de) * | 1994-03-12 | 1995-09-14 | Telefunken Microelectron | Hochspannungs-Trimmpotentiometer |
JPH09186006A (ja) * | 1995-12-28 | 1997-07-15 | Hokuriku Electric Ind Co Ltd | 高電圧用抵抗器ユニット及び高電圧用可変抵抗器ユニット |
DE10042764A1 (de) * | 2000-08-31 | 2002-03-14 | Moeller Gmbh | Verfahren zur Herstellung eines massereichen ohmschen Widerstands und elektronische Baueinheit |
KR100619352B1 (ko) * | 2005-04-29 | 2006-09-06 | 삼성전기주식회사 | 개질된 환형 올레핀 공중합체를 이용한 섬유 직물 강화재,및 인쇄회로기판용 수지기판 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2662957A (en) * | 1949-10-29 | 1953-12-15 | Eisler Paul | Electrical resistor or semiconductor |
US2758275A (en) * | 1952-12-12 | 1956-08-07 | Fox Prod Co | Battery testing apparatus |
US2781277A (en) * | 1954-01-12 | 1957-02-12 | Sanders Associates Inc | Method of manufacturing electrical resistors |
US3391373A (en) * | 1965-07-12 | 1968-07-02 | Western Electric Co | Beta tantalum resistors |
US3629782A (en) * | 1970-10-06 | 1971-12-21 | Cogar Corp | Resistor with means for decreasing current density |
DE2050675A1 (de) * | 1970-10-15 | 1972-04-20 | Vdo Schindling | Kleindreh widerstand |
US3808576A (en) * | 1971-01-15 | 1974-04-30 | Mica Corp | Circuit board with resistance layer |
US3848111A (en) * | 1973-09-24 | 1974-11-12 | Corning Glass Works | Electrical heating unit |
-
1972
- 1972-12-28 JP JP732761A patent/JPS5535843B2/ja not_active Expired
-
1973
- 1973-12-24 DE DE2364520A patent/DE2364520C3/de not_active Expired
-
1976
- 1976-10-21 US US05/734,469 patent/US4087779A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4087779A (en) | 1978-05-02 |
DE2364520A1 (de) | 1974-07-18 |
JPS4989148A (US07935154-20110503-C00006.png) | 1974-08-26 |
DE2364520C3 (de) | 1982-01-21 |
DE2364520B2 (de) | 1978-01-26 |