JPS5535807Y2 - - Google Patents
Info
- Publication number
- JPS5535807Y2 JPS5535807Y2 JP1975102164U JP10216475U JPS5535807Y2 JP S5535807 Y2 JPS5535807 Y2 JP S5535807Y2 JP 1975102164 U JP1975102164 U JP 1975102164U JP 10216475 U JP10216475 U JP 10216475U JP S5535807 Y2 JPS5535807 Y2 JP S5535807Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975102164U JPS5535807Y2 (cg-RX-API-DMAC7.html) | 1975-07-22 | 1975-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975102164U JPS5535807Y2 (cg-RX-API-DMAC7.html) | 1975-07-22 | 1975-07-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5216864U JPS5216864U (cg-RX-API-DMAC7.html) | 1977-02-05 |
| JPS5535807Y2 true JPS5535807Y2 (cg-RX-API-DMAC7.html) | 1980-08-23 |
Family
ID=28583613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975102164U Expired JPS5535807Y2 (cg-RX-API-DMAC7.html) | 1975-07-22 | 1975-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5535807Y2 (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6223096Y2 (cg-RX-API-DMAC7.html) * | 1981-04-20 | 1987-06-12 | ||
| JP2604885B2 (ja) * | 1990-06-25 | 1997-04-30 | 松下電子工業株式会社 | 樹脂封止型半導体装置 |
-
1975
- 1975-07-22 JP JP1975102164U patent/JPS5535807Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5216864U (cg-RX-API-DMAC7.html) | 1977-02-05 |