JPS5531822Y2 - - Google Patents
Info
- Publication number
- JPS5531822Y2 JPS5531822Y2 JP1974147854U JP14785474U JPS5531822Y2 JP S5531822 Y2 JPS5531822 Y2 JP S5531822Y2 JP 1974147854 U JP1974147854 U JP 1974147854U JP 14785474 U JP14785474 U JP 14785474U JP S5531822 Y2 JPS5531822 Y2 JP S5531822Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974147854U JPS5531822Y2 (ja�@�@) | 1974-12-05 | 1974-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1974147854U JPS5531822Y2 (ja�@�@) | 1974-12-05 | 1974-12-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5173973U JPS5173973U (ja�@�@) | 1976-06-10 |
| JPS5531822Y2 true JPS5531822Y2 (ja�@�@) | 1980-07-29 |
Family
ID=28438961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1974147854U Expired JPS5531822Y2 (ja�@�@) | 1974-12-05 | 1974-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5531822Y2 (ja�@�@) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5756512Y2 (ja�@�@) * | 1975-12-18 | 1982-12-04 | ||
| JPS6098652A (ja) * | 1983-11-02 | 1985-06-01 | Mitsubishi Electric Corp | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS568017B2 (ja�@�@) * | 1972-06-02 | 1981-02-20 |
-
1974
- 1974-12-05 JP JP1974147854U patent/JPS5531822Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5173973U (ja�@�@) | 1976-06-10 |