JPS5173973U - - Google Patents

Info

Publication number
JPS5173973U
JPS5173973U JP1974147854U JP14785474U JPS5173973U JP S5173973 U JPS5173973 U JP S5173973U JP 1974147854 U JP1974147854 U JP 1974147854U JP 14785474 U JP14785474 U JP 14785474U JP S5173973 U JPS5173973 U JP S5173973U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1974147854U
Other languages
Japanese (ja)
Other versions
JPS5531822Y2 (ja�@�@
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974147854U priority Critical patent/JPS5531822Y2/ja
Publication of JPS5173973U publication Critical patent/JPS5173973U/ja
Application granted granted Critical
Publication of JPS5531822Y2 publication Critical patent/JPS5531822Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1974147854U 1974-12-05 1974-12-05 Expired JPS5531822Y2 (ja�@�@)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1974147854U JPS5531822Y2 (ja�@�@) 1974-12-05 1974-12-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974147854U JPS5531822Y2 (ja�@�@) 1974-12-05 1974-12-05

Publications (2)

Publication Number Publication Date
JPS5173973U true JPS5173973U (ja�@�@) 1976-06-10
JPS5531822Y2 JPS5531822Y2 (ja�@�@) 1980-07-29

Family

ID=28438961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974147854U Expired JPS5531822Y2 (ja�@�@) 1974-12-05 1974-12-05

Country Status (1)

Country Link
JP (1) JPS5531822Y2 (ja�@�@)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283662U (ja�@�@) * 1975-12-18 1977-06-22
JPS6098652A (ja) * 1983-11-02 1985-06-01 Mitsubishi Electric Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913109A (ja�@�@) * 1972-06-02 1974-02-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4913109A (ja�@�@) * 1972-06-02 1974-02-05

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5283662U (ja�@�@) * 1975-12-18 1977-06-22
JPS6098652A (ja) * 1983-11-02 1985-06-01 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JPS5531822Y2 (ja�@�@) 1980-07-29

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