JPS5531303A - Cutting method for wafer of surface wave filter - Google Patents

Cutting method for wafer of surface wave filter

Info

Publication number
JPS5531303A
JPS5531303A JP10386178A JP10386178A JPS5531303A JP S5531303 A JPS5531303 A JP S5531303A JP 10386178 A JP10386178 A JP 10386178A JP 10386178 A JP10386178 A JP 10386178A JP S5531303 A JPS5531303 A JP S5531303A
Authority
JP
Japan
Prior art keywords
wafer
main surface
electrode pattern
cutting
wave filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10386178A
Other languages
Japanese (ja)
Inventor
Takuji Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10386178A priority Critical patent/JPS5531303A/en
Publication of JPS5531303A publication Critical patent/JPS5531303A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Abstract

PURPOSE:To realize a good cutting method for the wafer of the surface wave filter by giving the first-half cutting with shaving the wafer formed to the electrode pattern from its main surface to the lower side and then giving the second cutting from the lower part up to the main surface, thus causing no cracking. CONSTITUTION:Main surface 22 where no electrode pattern is formed to wafer 21 made of the single crystal of LiNbO3 is stuck onto wafer feed table 24, thus fixing wafer 21. Then the wafer is carried in a fixed speed to be cut downward by cutter 25 rotating in a high speed from the main surface where the electrode pattern is formed and in the depth up to 30% of the total wafer thickness. After this, table 24 is carried backward to give an upward cut to the other main surface 22 of the rest of the wafer via cutter 25 and along the cutting groove put onto the wafer. Thus pellet 26 is obtained.
JP10386178A 1978-08-28 1978-08-28 Cutting method for wafer of surface wave filter Pending JPS5531303A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10386178A JPS5531303A (en) 1978-08-28 1978-08-28 Cutting method for wafer of surface wave filter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10386178A JPS5531303A (en) 1978-08-28 1978-08-28 Cutting method for wafer of surface wave filter

Publications (1)

Publication Number Publication Date
JPS5531303A true JPS5531303A (en) 1980-03-05

Family

ID=14365223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10386178A Pending JPS5531303A (en) 1978-08-28 1978-08-28 Cutting method for wafer of surface wave filter

Country Status (1)

Country Link
JP (1) JPS5531303A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236264A (en) * 1991-06-10 1993-08-17 Nsk Ltd. Linear bearing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236264A (en) * 1991-06-10 1993-08-17 Nsk Ltd. Linear bearing

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