JPS5530207A - Main station connection system of key telephone system - Google Patents
Main station connection system of key telephone systemInfo
- Publication number
- JPS5530207A JPS5530207A JP10235378A JP10235378A JPS5530207A JP S5530207 A JPS5530207 A JP S5530207A JP 10235378 A JP10235378 A JP 10235378A JP 10235378 A JP10235378 A JP 10235378A JP S5530207 A JPS5530207 A JP S5530207A
- Authority
- JP
- Japan
- Prior art keywords
- main
- main station
- switch
- signal
- key telephone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M9/00—Arrangements for interconnection not involving centralised switching
- H04M9/002—Arrangements for interconnection not involving centralised switching with subscriber controlled access to a line, i.e. key telephone systems
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Sub-Exchange Stations And Push- Button Telephones (AREA)
Abstract
PURPOSE:To make it possible to connect easily a main station in a key telephone system not by making the connection of the main station by a mechanical main-wire acquisition switch but by discriminating by the acquisition signal of the main station whether or not the connection is possible. CONSTITUTION:When hook switch 24 is closed by lifting the handset of main station 3, its channels 21 . 22 are connected to directcurrent supply resistances 10 and 11 by contacts 4b-1 and 4b-2 and hook switch detection circuit 29 operates by the information to send out its signal to main-wire acquisition switch 7-1 via line 30. Therefore, the signal is sent, with switch 7-1 closed, to main-wire acquisition holding circuit 31 in parpllel to control part 6, thereby resetting relay 4b. As a result, main station 3 is connected to main wires 8 . 9 by contacts 4b-1 and 4b-2 via relay 5b to make contact 5b-1, thereby maintaining a main-wire acquisition state until the call ends.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10235378A JPS5839437B2 (en) | 1978-08-24 | 1978-08-24 | This telephone connection method for button telephone equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10235378A JPS5839437B2 (en) | 1978-08-24 | 1978-08-24 | This telephone connection method for button telephone equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5530207A true JPS5530207A (en) | 1980-03-04 |
JPS5839437B2 JPS5839437B2 (en) | 1983-08-30 |
Family
ID=14325104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10235378A Expired JPS5839437B2 (en) | 1978-08-24 | 1978-08-24 | This telephone connection method for button telephone equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5839437B2 (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4801420A (en) * | 1985-09-11 | 1989-01-31 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Process for forming a film |
US4822853A (en) * | 1985-07-16 | 1989-04-18 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Amphiphilic polyimide precursor containing c12-c30 hydrophobic groups and langmuir-blodgett films therefrom |
US4839219A (en) * | 1986-05-20 | 1989-06-13 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Thin film and device having the same |
US4910293A (en) * | 1985-11-20 | 1990-03-20 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Langmuir-Blodgett films of polymers having pendent C10 -C30 hydrocarbon groups |
US4987219A (en) * | 1986-04-25 | 1991-01-22 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Copolymeric and amphiphilic polyimide precursor, process for preparing the same and thin film |
JPH03133132A (en) * | 1989-10-06 | 1991-06-06 | Internatl Business Mach Corp <Ibm> | Conductor pattern formation |
US5043248A (en) * | 1986-09-04 | 1991-08-27 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Photosensitive amhilphilic high polymers and process for producing them |
US5072262A (en) * | 1986-03-11 | 1991-12-10 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Electric-electronic device including polyimide thin film |
EP0702270A2 (en) | 1994-09-13 | 1996-03-20 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
US6160081A (en) * | 1997-10-31 | 2000-12-12 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
US6232032B1 (en) | 1998-05-29 | 2001-05-15 | Hitachi Chemical Dupont Microsystems L.L.C. | Photosensitive polymer composition, method for forming relief patterns, and electronic parts |
US6310135B1 (en) | 1995-04-18 | 2001-10-30 | Nippon Zeon Co., Ltd. | Polyimide resin composition |
US6528231B1 (en) | 1999-01-25 | 2003-03-04 | Riken | Photosensitive resin composition, printed wiring board, substrate for disposing semiconductor chips, semiconductor device and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device |
US6686106B2 (en) | 2000-06-26 | 2004-02-03 | Ube Industries, Ltd. | Photosensitive resin compositions, insulating films, and processes for formation of the films |
US7150947B2 (en) | 2002-05-17 | 2006-12-19 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment |
US7892720B2 (en) | 2006-03-16 | 2011-02-22 | Asahi Glass Company, Limited | Negative photosensitive fluorinated aromatic resin composition |
KR20110059867A (en) | 2008-10-02 | 2011-06-07 | 다이니폰 인사츠 가부시키가이샤 | Photosensitive resin composition, article using same, and method for forming negative pattern |
US8231959B2 (en) | 2004-01-14 | 2012-07-31 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive polymer composition, method of producing pattern and electronic parts |
-
1978
- 1978-08-24 JP JP10235378A patent/JPS5839437B2/en not_active Expired
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4822853A (en) * | 1985-07-16 | 1989-04-18 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Amphiphilic polyimide precursor containing c12-c30 hydrophobic groups and langmuir-blodgett films therefrom |
US4988795A (en) * | 1985-07-16 | 1991-01-29 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Amphiphilic polyimide precursor and process for preparing the same from fatty-substituted polyamide-acids |
US4801420A (en) * | 1985-09-11 | 1989-01-31 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Process for forming a film |
US4910293A (en) * | 1985-11-20 | 1990-03-20 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Langmuir-Blodgett films of polymers having pendent C10 -C30 hydrocarbon groups |
US5072262A (en) * | 1986-03-11 | 1991-12-10 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Electric-electronic device including polyimide thin film |
US4987219A (en) * | 1986-04-25 | 1991-01-22 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Copolymeric and amphiphilic polyimide precursor, process for preparing the same and thin film |
US4839219A (en) * | 1986-05-20 | 1989-06-13 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Thin film and device having the same |
US5043248A (en) * | 1986-09-04 | 1991-08-27 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Photosensitive amhilphilic high polymers and process for producing them |
JPH03133132A (en) * | 1989-10-06 | 1991-06-06 | Internatl Business Mach Corp <Ibm> | Conductor pattern formation |
EP0702270A2 (en) | 1994-09-13 | 1996-03-20 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
US5777068A (en) * | 1994-09-13 | 1998-07-07 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
US6734248B2 (en) | 1995-04-18 | 2004-05-11 | Nippon Zeon Co., Ltd. | Pattern forming process using polyimide resin composition |
US6310135B1 (en) | 1995-04-18 | 2001-10-30 | Nippon Zeon Co., Ltd. | Polyimide resin composition |
US6743851B2 (en) | 1995-04-18 | 2004-06-01 | Nippon Zeon Co., Ltd. | Polyimide film |
US6160081A (en) * | 1997-10-31 | 2000-12-12 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
US6365306B2 (en) | 1998-05-29 | 2002-04-02 | Hitachi Chemical Dupont Microsystems L.L.C. | Photosensitive polymer composition, method for forming relief patterns, and electronic parts |
US6232032B1 (en) | 1998-05-29 | 2001-05-15 | Hitachi Chemical Dupont Microsystems L.L.C. | Photosensitive polymer composition, method for forming relief patterns, and electronic parts |
US6528231B1 (en) | 1999-01-25 | 2003-03-04 | Riken | Photosensitive resin composition, printed wiring board, substrate for disposing semiconductor chips, semiconductor device and processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device |
US6709804B2 (en) | 1999-01-25 | 2004-03-23 | Riken | Printed wiring board and semiconductor device and processes to prepare the same |
US6686106B2 (en) | 2000-06-26 | 2004-02-03 | Ube Industries, Ltd. | Photosensitive resin compositions, insulating films, and processes for formation of the films |
US7150947B2 (en) | 2002-05-17 | 2006-12-19 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment |
US7851128B2 (en) | 2002-05-17 | 2010-12-14 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment |
US8304149B2 (en) | 2002-05-17 | 2012-11-06 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment |
US8231959B2 (en) | 2004-01-14 | 2012-07-31 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive polymer composition, method of producing pattern and electronic parts |
US8852726B2 (en) | 2004-01-14 | 2014-10-07 | Hitachi Chemical Dupont Microsystems Ltd. | Photosensitive polymer composition, method of producing pattern and electronic parts |
US7892720B2 (en) | 2006-03-16 | 2011-02-22 | Asahi Glass Company, Limited | Negative photosensitive fluorinated aromatic resin composition |
KR20110059867A (en) | 2008-10-02 | 2011-06-07 | 다이니폰 인사츠 가부시키가이샤 | Photosensitive resin composition, article using same, and method for forming negative pattern |
Also Published As
Publication number | Publication date |
---|---|
JPS5839437B2 (en) | 1983-08-30 |
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