JPS5529562U - - Google Patents

Info

Publication number
JPS5529562U
JPS5529562U JP1978113193U JP11319378U JPS5529562U JP S5529562 U JPS5529562 U JP S5529562U JP 1978113193 U JP1978113193 U JP 1978113193U JP 11319378 U JP11319378 U JP 11319378U JP S5529562 U JPS5529562 U JP S5529562U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1978113193U
Other versions
JPS598361Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978113193U priority Critical patent/JPS598361Y2/ja
Publication of JPS5529562U publication Critical patent/JPS5529562U/ja
Application granted granted Critical
Publication of JPS598361Y2 publication Critical patent/JPS598361Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48153—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/48195—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
JP1978113193U 1978-08-17 1978-08-17 Ｉｃパツケ−ジ Expired JPS598361Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978113193U JPS598361Y2 (ja) 1978-08-17 1978-08-17 Ｉｃパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978113193U JPS598361Y2 (ja) 1978-08-17 1978-08-17 Ｉｃパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS5529562U true JPS5529562U (ja) 1980-02-26
JPS598361Y2 JPS598361Y2 (ja) 1984-03-15

Family

ID=29062776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978113193U Expired JPS598361Y2 (ja) 1978-08-17 1978-08-17 Ｉｃパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS598361Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104675U (ja) * 1982-01-09 1983-07-16 キング商事株式会社 連続伝票発行器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58104675U (ja) * 1982-01-09 1983-07-16 キング商事株式会社 連続伝票発行器
JPS6213823Y2 (ja) * 1982-01-09 1987-04-09

Also Published As

Publication number Publication date
JPS598361Y2 (ja) 1984-03-15

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