JPS5528549B2 - - Google Patents

Info

Publication number
JPS5528549B2
JPS5528549B2 JP8832475A JP8832475A JPS5528549B2 JP S5528549 B2 JPS5528549 B2 JP S5528549B2 JP 8832475 A JP8832475 A JP 8832475A JP 8832475 A JP8832475 A JP 8832475A JP S5528549 B2 JPS5528549 B2 JP S5528549B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8832475A
Other languages
Japanese (ja)
Other versions
JPS5212576A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8832475A priority Critical patent/JPS5212576A/en
Publication of JPS5212576A publication Critical patent/JPS5212576A/en
Publication of JPS5528549B2 publication Critical patent/JPS5528549B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP8832475A 1975-07-21 1975-07-21 Wafer washing drying device Granted JPS5212576A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8832475A JPS5212576A (en) 1975-07-21 1975-07-21 Wafer washing drying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8832475A JPS5212576A (en) 1975-07-21 1975-07-21 Wafer washing drying device

Publications (2)

Publication Number Publication Date
JPS5212576A JPS5212576A (en) 1977-01-31
JPS5528549B2 true JPS5528549B2 (en) 1980-07-29

Family

ID=13939712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8832475A Granted JPS5212576A (en) 1975-07-21 1975-07-21 Wafer washing drying device

Country Status (1)

Country Link
JP (1) JPS5212576A (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5669830A (en) * 1979-11-13 1981-06-11 Nec Kyushu Ltd Photo resist processing device for semiconductor device
WO1984004583A1 (en) * 1980-04-23 1984-11-22 Seiichiro Aigoo Dryer
JPS61178187U (en) * 1985-04-26 1986-11-06
JPS62166524A (en) * 1986-01-20 1987-07-23 Mitsubishi Electric Corp Centrifugal dehydrator
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
US6350319B1 (en) 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
US6413436B1 (en) 1999-01-27 2002-07-02 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
US6264752B1 (en) 1998-03-13 2001-07-24 Gary L. Curtis Reactor for processing a microelectronic workpiece
US6423642B1 (en) 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
TW452828B (en) * 1998-03-13 2001-09-01 Semitool Inc Micro-environment reactor for processing a microelectronic workpiece
US6318385B1 (en) 1998-03-13 2001-11-20 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
US6432214B2 (en) 1998-07-10 2002-08-13 Semitool, Inc. Cleaning apparatus
US6680253B2 (en) 1999-01-22 2004-01-20 Semitool, Inc. Apparatus for processing a workpiece
US6511914B2 (en) 1999-01-22 2003-01-28 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US7217325B2 (en) 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
US6548411B2 (en) 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US6492284B2 (en) 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
US6505634B2 (en) * 2001-03-23 2003-01-14 Will Be S & T Co., Ltd. Semiconductor wafer cleaning apparatus
JP2002353181A (en) * 2001-05-30 2002-12-06 Ses Co Ltd Sheet substrate cleaning method and sheet substrate cleaning device
JP7132870B2 (en) * 2019-02-26 2022-09-07 エスペック株式会社 Environmental test equipment and test equipment
CN110369393B (en) * 2019-08-13 2021-04-06 安徽晶天新能源科技有限责任公司 Ultrasonic cleaning machine is used in silicon chip production

Also Published As

Publication number Publication date
JPS5212576A (en) 1977-01-31

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