CN110369393B - Ultrasonic cleaning machine is used in silicon chip production - Google Patents
Ultrasonic cleaning machine is used in silicon chip production Download PDFInfo
- Publication number
- CN110369393B CN110369393B CN201910743796.2A CN201910743796A CN110369393B CN 110369393 B CN110369393 B CN 110369393B CN 201910743796 A CN201910743796 A CN 201910743796A CN 110369393 B CN110369393 B CN 110369393B
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- Prior art keywords
- wall
- silicon wafer
- rotary drum
- machine body
- ultrasonic cleaning
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/041—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
Abstract
The invention discloses an ultrasonic cleaning machine for silicon wafer production, which comprises a machine body, wherein an electric control panel is embedded in the outer wall of one side of the machine body, a motor is fixedly connected to the outer wall of one side of the machine body, which is adjacent to the electric control panel, through a bolt, one end of the motor is rotatably connected with a rotary drum through a rotary shaft, the outer wall of one side of the rotary drum is rotatably connected with a drum cover through a hinge, and a sealing box is arranged on the outer wall of one side of the rotary drum, which is adjacent to the drum cover, the ultrasonic cleaning machine for silicon wafer production can provide additional water flow impact force for ultrasonic cleaning of silicon wafers through the rotary drum, so that on one hand, the vibration of the water flow is ensured to be uniformly contacted with the surfaces of the silicon wafers, the cleaning effect and uniformity are improved, on the other hand, the liquid after the silicon wafers are, reducing the reattachment of impurities in the subsequent cleaning liquid and improving the cleaning degree.
Description
Technical Field
The invention relates to the technical field of silicon wafer production, in particular to an ultrasonic cleaning machine for silicon wafer production.
Background
The silicon chip has remarkable calculation capability, no matter how complex mathematical problems, physical problems and engineering problems are, and no matter how large the calculation workload is, a worker can tell the problem to the silicon chip through a computer keyboard and issue thinking and instructions for solving the problem, and a computer can tell the answer to the silicon chip in a very short time, so that the problem that the manual calculation takes years and decades can be solved by the computer in only a few minutes. Even some people can not calculate the result, the computer can tell you the answer very fast.
The silicon chip on the market needs to wash the attachment and the impurity on silicon chip surface after processing at present, current silicon chip washs mostly through ultrasonic cleaner and washs, current ultrasonic cleaner still mostly is mostly to the washing on silicon chip surface through letting water vibration, because water is in under the microvibration state in ultrasonic cleaner, the mobility of water is poor, be difficult to abundant take away the impurity on the silicon chip, the silicon chip after the washing still has the impurity of aquatic to adsorb again, cause and wash not thorough, be difficult to carry out secondary cleaning's problem.
Disclosure of Invention
The invention aims to provide an ultrasonic cleaning machine for silicon wafer production, and aims to solve the problems that the existing silicon wafer cleaning machine is difficult to ensure the flow of water flow to clean impurities on a silicon wafer, cannot clean thoroughly and is difficult to perform secondary cleaning in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an ultrasonic cleaner for silicon chip production, includes the fuselage, the embedding has automatically controlled panel on one side outer wall of fuselage, and the fuselage is adjacent through bolt fixedly connected with motor on one side outer wall of automatically controlled panel, the one end of motor is rotated through the pivot and is connected with the rotary drum, it is connected with the cover through the hinge rotation on one side outer wall of rotary drum, and is provided with the seal box on the rotary drum is adjacent on one side outer wall of cover, through bolt fixedly connected with motor on one side inner wall of seal box, through bolt fixedly connected with water pump and water tank on one side outer wall of keeping away from the motor on the fuselage, the water pump is located one side of water tank, the inside central point department of putting of rotary drum is provided with the water pipe, be provided with the nozzle on.
Preferably, a touch display screen and a power switch are embedded in the outer wall of one side of the electric control panel, which is far away from the machine body, and the touch display screen is positioned above the power switch.
Preferably, the bottom of fuselage is provided with four supporting legss symmetrically, and the top of fuselage passes through the hinge and rotates and be connected with the cover.
Preferably, through holes are formed in the outer walls of the rotary drum and the drum cover on one side.
Preferably, one end of the motor is rotatably connected with a left-handed screw through a rotating shaft, and a right-handed screw is arranged at one end, far away from the motor, of the left-handed screw.
Preferably, the outer wall of one side of the left-handed screw rod is connected with a first retaining ring through threaded screwing, and the outer wall of one side of the right-handed screw rod is connected with a second retaining ring through threaded screwing.
Preferably, a water discharge valve is arranged at the central position of the bottom of the machine body, an ultrasonic transmitter is arranged on the inner wall of one side of the machine body, and a groove is formed in the outer wall of one side of the ultrasonic transmitter.
Preferably, a baffle and a clamping seat are arranged on the inner wall of one side of the rotating cylinder, and the baffle is positioned on one side of the clamping seat.
Preferably, a clamping groove is formed in the outer wall of one side of the clamping seat, an inner cavity is formed in the inner wall of one side of the clamping groove, a spring is arranged inside the inner cavity, and a soft rubber cushion is arranged at one end of the spring.
Preferably, a hose is arranged between the water tank and the water pipe and the water pump.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the ultrasonic cleaning machine for silicon wafer production, extra water flow impact force can be provided for ultrasonic cleaning of a silicon wafer through the rotary drum, on one hand, vibration of water flow is guaranteed to be uniformly contacted with the surface of the silicon wafer, cleaning effect and uniformity are improved, on the other hand, liquid after the silicon wafer is cleaned can be thrown out of the rotary drum through high-speed centrifugal force, impurity content in the rotary drum is reduced, a clean environment is provided for subsequent secondary cleaning, reattachment of impurities in subsequent cleaning liquid is reduced, and cleaning degree is improved;
2. according to the ultrasonic cleaning machine for silicon wafer production, the automatic outflow of cleaning liquid in the rotary drum is realized through the first retaining ring and the second retaining ring which move in opposite directions or in opposite directions, the cleaning liquid and impurities after one-time cleaning are discharged, the attachment of the impurities is avoided, the damage caused by the impact of the vibrated impurities on the surface of a silicon wafer is also avoided, and the forming quality of the silicon wafer is improved;
3. this ultrasonic cleaner is used in silicon chip production realizes the abluent washing liquid of secondary through the water pipe of the inside central point department of rotary drum and supplyes, provides clear mobile washing liquid when being convenient for secondary cleaning, and the cleaning of silicon chip when guaranteeing secondary cleaning improves ultrasonic cleaner's cleaning performance.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is an elevation view of the fuselage of the present invention;
FIG. 4 is a schematic view of the internal structure of the present invention;
FIG. 5 is a front view of the drum of the present invention;
FIG. 6 is a cross-sectional view of the drum of the present invention;
FIG. 7 is a schematic view of the internal structure of the drum according to the present invention;
FIG. 8 is a side view of the drum of the present invention;
fig. 9 is a side view of the cartridge of the present invention.
In the figure: 1. a body; 2. an electric control panel; 3. a motor; 4. a rotating drum; 5. a cylinder cover; 6. a sealing box; 7. a motor; 8. a water pump; 9. a water tank; 10. a water pipe; 11. a touch display screen; 12. a power switch; 13. supporting legs; 14. a machine cover; 15. a through hole; 16. a left-handed lead screw; 17. a right-handed screw; 18. a first retainer ring; 19. a second retainer ring; 20. a nozzle; 21. a drain valve; 22. an ultrasonic transmitter; 23. a groove; 24. a baffle plate; 25. a card holder; 26. a card slot; 27. an inner cavity; 28. a spring; 29. a soft rubber cushion; 30. a hose.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-9, the present invention provides a technical solution: the utility model provides an ultrasonic cleaner for silicon chip production, including fuselage 1, automatically controlled panel 2, motor 3, rotary drum 4, cover 5, seal box 6, motor 7, water pump 8, water tank 9, water pipe 10, touch display screen 11, switch 12, supporting legs 13, the cover 14, through-hole 15, levogyration lead screw 16, dextrorotation lead screw 17, first fender ring 18, second fender ring 19, nozzle 20, lower water valve 21, ultrasonic transmitter 22, recess 23, baffle 24, cassette 25, draw-in groove 26, inner chamber 27, spring 28, soft rubber pad 29, hose 30, automatically controlled panel 2 has been embedded on the outer wall of one side of fuselage 1, and fuselage 1 is adjacent to and has motor 3 through bolt fixed connection on the outer wall of one side of automatically controlled panel 2, the one end of motor 3 is connected with rotary drum 4 through the pivot rotation, be connected with through hinge rotation on the outer wall of one side of rotary drum 4. Cover 5, and rotary drum 4 is provided with seal box 6 on being adjacent to one side outer wall of cover 5, through bolt fixedly connected with motor 7 on one side inner wall of seal box 6, through bolt fixedly connected with water pump 8 and water tank 9 on keeping away from one side outer wall of motor 3 on fuselage 1, water pump 8 is located one side of water tank 9, the inside central authorities position department of rotary drum 4 is provided with water pipe 10, be provided with nozzle 20 on one side outer wall of water pipe 10, play the effect that rivers flow.
Furthermore, a touch display screen 11 and a power switch 12 are embedded in the outer wall of the side, far away from the body 1, of the electric control panel 2, and the touch display screen 11 is located above the power switch 12, so that touch screen control is facilitated.
Furthermore, four supporting legs 13 are symmetrically arranged at the bottom of the machine body 1, and the top of the machine body 1 is rotatably connected with a machine cover 14 through a hinge, so that the machine body 1 is ensured to be in a closed space.
Furthermore, through holes 15 are formed in the outer walls of the rotary drum 4 and the drum cover 5 on one side, and the water flow flowing effect is achieved.
Furthermore, one end of the motor 7 is rotatably connected with a left-handed lead screw 16 through a rotating shaft, and a right-handed lead screw 17 is arranged at one end, far away from the motor 7, of the left-handed lead screw 16.
Furthermore, a first retaining ring 18 is connected to the outer wall of one side of the left-handed lead screw 16 in a screwed mode through threads, and a second retaining ring 19 is connected to the outer wall of one side of the right-handed lead screw 17 in a screwed mode through threads, so that the through hole 15 is conveniently shielded, and the silicon wafer is fully cleaned by water in the rotary drum 4.
Furthermore, a water discharge valve 21 is arranged at the center of the bottom of the machine body 1, an ultrasonic emitter 22 is arranged on the inner wall of one side of the machine body 1, and a groove 23 is formed in the outer wall of one side of the ultrasonic emitter 22, so that the water flow is driven to vibrate.
Further, a baffle 24 and a clamping seat 25 are arranged on the inner wall of one side of the rotary drum 4, and the baffle 24 is positioned on one side of the clamping seat 25, so that the silicon wafer is fixed conveniently.
Furthermore, a clamping groove 26 is formed in the outer wall of one side of the clamping seat 25, an inner cavity 27 is formed in the inner wall of one side of the clamping groove 26, a spring 28 is arranged inside the inner cavity 27, and a soft rubber pad 29 is arranged at one end of the spring 28 to play a role in clamping a silicon wafer.
Furthermore, a hose 30 is arranged between the water tank 9 and the water pipe 10 and the water pump 8, so that water flow is facilitated.
The working principle is as follows: when the silicon wafer cleaning machine is used, the barrel cover 5 is opened, a silicon wafer is inserted into the clamping seat 25 between the two baffles 24, the soft rubber cushion 29 is extruded, the silicon wafer is clamped tightly through the elastic deformation of the spring 28, cleaning liquid is poured into the rotary drum 4, the barrel cover 5 is closed, the rotary drum 4 is driven to rotate through the rotary shaft by the motor 3, the rotary drum 4 drives the silicon wafer to rotate, the silicon wafer is cleaned through the full contact between the cleaning liquid in the rotary drum 4 and the silicon wafer, the liquid in the groove 23 is vibrated after the ultrasonic emitter 22 works, the cleaning liquid in the rotary drum 4 is also vibrated through the resonance of the liquid, the attachments and impurities on the silicon wafer are cleaned by the vibrated cleaning liquid, after the ultrasonic emitter 22 works for a period of time, the left-handed lead screw 16 is driven to rotate by the motor 7 through the rotary shaft, the left-handed lead screw 16 drives the right-handed lead screw 17 to rotate, the left-handed lead, the first retaining ring 18 and the second retaining ring 19 move oppositely or oppositely, the first retaining ring 18 and the second retaining ring 19 move in the rotary drum 4, the through hole 15 is exposed, along with the rotation of the rotary drum 4, the cleaning liquid and impurities in the rotary drum 4 are thrown away by centrifugal force generated by the rotation of the rotary drum 4, after the cleaning liquid is discharged, the motor 7 rotates reversely, the through hole 15 is shielded by the first retaining ring 18 and the second retaining ring 19 after moving, the cleaning liquid in the water tank 9 is pressed into the water pipe 10 through the hose 30 by the water pump 8, and finally the cleaning liquid is sprayed into the rotary drum 4 through the nozzle 20, so that the re-cleaning is facilitated, and the attachment of the impurities is reduced.
Finally, it should be noted that the above-mentioned contents are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, and that the simple modifications or equivalent substitutions of the technical solutions of the present invention by those of ordinary skill in the art can be made without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. The utility model provides an ultrasonic cleaner is used in silicon chip production, includes fuselage (1), its characterized in that: the electric control device is characterized in that an electric control panel (2) is embedded into the outer wall of one side of the machine body (1), the outer wall of one side, adjacent to the electric control panel (2), of the machine body (1) is connected with a motor (3) through bolts in a fixed mode, one end of the motor (3) is connected with a rotary drum (4) through a rotary shaft in a rotary mode, a drum cover (5) is connected onto the outer wall of one side of the rotary drum (4) through a hinge in a rotary mode, a sealing box (6) is arranged on the outer wall of one side, adjacent to the drum cover (5), of the rotary drum (4), a motor (7) is connected onto the inner wall of one side of the sealing box (6) through bolts in a fixed mode, a water pump (8) and a water tank (9) are fixedly connected onto the outer wall of one side, far away from the motor (3), of the machine body (, be provided with nozzle (20) on one side outer wall of water pipe (10), the one end of motor (7) is rotated through the pivot and is connected with levogyration lead screw (16), the one end of keeping away from motor (7) on levogyration lead screw (16) is provided with dextrorotation lead screw (17), it is connected with first fender ring (18) to close soon through the screw thread on one side outer wall of levogyration lead screw (16), it is connected with second fender ring (19) to close soon through the screw thread on one side outer wall of dextrorotation lead screw (17).
2. The ultrasonic cleaning machine for silicon wafer production according to claim 1, wherein: the touch display screen (11) and the power switch (12) are embedded into the outer wall of one side, far away from the machine body (1), of the electric control panel (2), and the touch display screen (11) is located above the power switch (12).
3. The ultrasonic cleaning machine for silicon wafer production according to claim 1, wherein: the bottom of the machine body (1) is symmetrically provided with four supporting legs (13), and the top of the machine body (1) is rotatably connected with a machine cover (14) through a hinge.
4. The ultrasonic cleaning machine for silicon wafer production according to claim 1, wherein: through holes (15) are formed in the outer walls of the rotary drum (4) and the drum cover (5) on one side.
5. The ultrasonic cleaning machine for silicon wafer production according to claim 1, wherein: a water discharge valve (21) is arranged at the central position of the bottom of the machine body (1), an ultrasonic transmitter (22) is arranged on the inner wall of one side of the machine body (1), and a groove (23) is formed in the outer wall of one side of the ultrasonic transmitter (22).
6. The ultrasonic cleaning machine for silicon wafer production according to claim 1, wherein: a baffle (24) and a clamping seat (25) are arranged on the inner wall of one side of the rotary drum (4), and the baffle (24) is located on one side of the clamping seat (25).
7. The ultrasonic cleaning machine for silicon wafer production according to claim 6, wherein: the clamping groove (26) is formed in the outer wall of one side of the clamping seat (25), the inner cavity (27) is formed in the inner wall of one side of the clamping groove (26), the spring (28) is arranged inside the inner cavity (27), and the soft rubber pad (29) is arranged at one end of the spring (28).
8. The ultrasonic cleaning machine for silicon wafer production according to claim 1, wherein: and a hose (30) is arranged between the water tank (9) and the water pipe (10) and the water pump (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910743796.2A CN110369393B (en) | 2019-08-13 | 2019-08-13 | Ultrasonic cleaning machine is used in silicon chip production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910743796.2A CN110369393B (en) | 2019-08-13 | 2019-08-13 | Ultrasonic cleaning machine is used in silicon chip production |
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| Publication Number | Publication Date |
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| CN110369393A CN110369393A (en) | 2019-10-25 |
| CN110369393B true CN110369393B (en) | 2021-04-06 |
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| CN111457684B (en) * | 2020-04-08 | 2021-06-15 | 夏相堂 | Diode dehydrator |
| CN111495869A (en) * | 2020-05-08 | 2020-08-07 | 王静 | Biopsy needle ultrasonic cleaning device |
| CN115069666B (en) * | 2022-06-17 | 2023-04-14 | 广东和源新材料有限公司 | Method and device for preparing silica sol |
| CN115990589B (en) * | 2023-03-22 | 2023-06-06 | 深圳市华芯邦科技有限公司 | Multi-angle chip cleaning device and cleaning method |
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| JPS5212576A (en) * | 1975-07-21 | 1977-01-31 | Hitachi Ltd | Wafer washing drying device |
| CN1567541A (en) * | 2003-07-02 | 2005-01-19 | 上海思恩电子技术有限公司 | Method and system for processing substrate using mist chemical agent produced by heating chemical gas |
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