JPS5528364A - Thick-wall metal plated wire and production thereof - Google Patents
Thick-wall metal plated wire and production thereofInfo
- Publication number
- JPS5528364A JPS5528364A JP10154578A JP10154578A JPS5528364A JP S5528364 A JPS5528364 A JP S5528364A JP 10154578 A JP10154578 A JP 10154578A JP 10154578 A JP10154578 A JP 10154578A JP S5528364 A JPS5528364 A JP S5528364A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- tank
- wire body
- plated layer
- fusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
PURPOSE: To produce desired thick-wall plated wires excelling in adhesion of plated layer, by forming a thin-wall plated layer on the surface of metal wire body by fusion plating, and applying electroplating on the surface of metal wire body by fusion plating, and electroplatingon the surface of this plated layer.
CONSTITUTION: A wire body 2 such as copper iwre is introduced into a cleaning tank 8 and is degreased, and is then introduced into a molten metal tank 9 to be passed into low melting point alloy metal such as Pb-Sn etc., and a thin fusion plated layer of about 0.5 to 1.0 μm is formed by passing into a wiper device 10 at the exit side. In succession, after cooling in a cooling tank 11, the wire body is led into an electroplating tank 12, and by applying DC voltage, metal molecules are elctrolytically deposited on the surface of the fusion plated layer from the electrolytic bath of the metal homoneous to the metal in the molten metal tank or the metal excelling in compatibility. Then, the wire body is passed into a water washing tank 16 and is sent to a take-up device 17. In this method, thick-wall plated wires of uniform thiskness may be produced efficiently.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10154578A JPS5528364A (en) | 1978-08-21 | 1978-08-21 | Thick-wall metal plated wire and production thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10154578A JPS5528364A (en) | 1978-08-21 | 1978-08-21 | Thick-wall metal plated wire and production thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5528364A true JPS5528364A (en) | 1980-02-28 |
| JPS5736997B2 JPS5736997B2 (en) | 1982-08-06 |
Family
ID=14303399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10154578A Granted JPS5528364A (en) | 1978-08-21 | 1978-08-21 | Thick-wall metal plated wire and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5528364A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4954233A (en) * | 1972-09-29 | 1974-05-27 |
-
1978
- 1978-08-21 JP JP10154578A patent/JPS5528364A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4954233A (en) * | 1972-09-29 | 1974-05-27 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5736997B2 (en) | 1982-08-06 |
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