JPS5528339A - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
JPS5528339A
JPS5528339A JP10079378A JP10079378A JPS5528339A JP S5528339 A JPS5528339 A JP S5528339A JP 10079378 A JP10079378 A JP 10079378A JP 10079378 A JP10079378 A JP 10079378A JP S5528339 A JPS5528339 A JP S5528339A
Authority
JP
Japan
Prior art keywords
plated
plating solution
plating
opening parts
injected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10079378A
Other languages
Japanese (ja)
Other versions
JPS6059997B2 (en
Inventor
Kazuhiro Taniguchi
Koji Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP10079378A priority Critical patent/JPS6059997B2/en
Publication of JPS5528339A publication Critical patent/JPS5528339A/en
Publication of JPS6059997B2 publication Critical patent/JPS6059997B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To clearly distinguish the boundary of the plated part and unplated part, by injecting the plating solution from the nozzle which is commonly used as the anode horizontally at the part to be plated of the material being plated and electrolytic plating in the opening part of the mask body.
CONSTITUTION: The part to be plated of the material being plated 106 is divided and exposed by opening parts 108a, 108b of mask bodies 107a, 107b. The plating solution is injected in the horizontal direction from nozzles 102a, 102b which are commonly used as anodes, and the part to be plated which is cathodized through conductive bands 118a, 118b are electrolytically plated. The plating solution is recovered by the opening parts 108a, 108b through the slopes of the injection openings of the lid body. After plating treatment, air is injected from air nozzles 115a, 115b, and blows off the plating solution remaining in the part to be plated and the plating solution remaining in the opening parts to recover. Then, the mask bodies 107a, 107b are separated from the material being plated 106, and then the material being plated 106 is taken out.
COPYRIGHT: (C)1980,JPO&Japio
JP10079378A 1978-08-18 1978-08-18 plating device Expired JPS6059997B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10079378A JPS6059997B2 (en) 1978-08-18 1978-08-18 plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10079378A JPS6059997B2 (en) 1978-08-18 1978-08-18 plating device

Publications (2)

Publication Number Publication Date
JPS5528339A true JPS5528339A (en) 1980-02-28
JPS6059997B2 JPS6059997B2 (en) 1985-12-27

Family

ID=14283300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10079378A Expired JPS6059997B2 (en) 1978-08-18 1978-08-18 plating device

Country Status (1)

Country Link
JP (1) JPS6059997B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61288092A (en) * 1985-06-17 1986-12-18 Hitachi Ltd Partial plating method
KR100974266B1 (en) * 2008-08-12 2010-08-06 (주) 세기정밀 Electroplating apparatus obtain two-sided read frame
JP2015151567A (en) * 2014-02-13 2015-08-24 株式会社デンソー Plating device and plating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61288092A (en) * 1985-06-17 1986-12-18 Hitachi Ltd Partial plating method
KR100974266B1 (en) * 2008-08-12 2010-08-06 (주) 세기정밀 Electroplating apparatus obtain two-sided read frame
JP2015151567A (en) * 2014-02-13 2015-08-24 株式会社デンソー Plating device and plating method

Also Published As

Publication number Publication date
JPS6059997B2 (en) 1985-12-27

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