JPS5527566B2 - - Google Patents
Info
- Publication number
- JPS5527566B2 JPS5527566B2 JP6913675A JP6913675A JPS5527566B2 JP S5527566 B2 JPS5527566 B2 JP S5527566B2 JP 6913675 A JP6913675 A JP 6913675A JP 6913675 A JP6913675 A JP 6913675A JP S5527566 B2 JPS5527566 B2 JP S5527566B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6913675A JPS51145590A (en) | 1975-06-10 | 1975-06-10 | Curable vinyl ester resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6913675A JPS51145590A (en) | 1975-06-10 | 1975-06-10 | Curable vinyl ester resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51145590A JPS51145590A (en) | 1976-12-14 |
| JPS5527566B2 true JPS5527566B2 (fi) | 1980-07-22 |
Family
ID=13393916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6913675A Granted JPS51145590A (en) | 1975-06-10 | 1975-06-10 | Curable vinyl ester resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51145590A (fi) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55102617A (en) * | 1979-01-31 | 1980-08-06 | Dainippon Ink & Chem Inc | Resin composition useful as impregnating agent, spacer material, leveling material and cushioning medium |
| EP0129725B1 (en) * | 1983-05-26 | 1990-03-14 | Union Carbide Corporation | Improved low shrinking curable poly(acrylate) molding compositions |
| JPH0714992B2 (ja) * | 1985-03-07 | 1995-02-22 | ダイセル化学工業株式会社 | 電子部品封止用樹脂組成物 |
| JPH0714993B2 (ja) * | 1985-03-15 | 1995-02-22 | ダイセル化学工業株式会社 | 電子部品用表面コーテイング剤 |
| CN109071738B (zh) * | 2016-07-11 | 2022-01-04 | 日本复合材料株式会社 | 自由基固化性树脂组合物及其固化物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4947450A (fi) * | 1972-08-21 | 1974-05-08 | ||
| JPS4961241A (fi) * | 1972-09-21 | 1974-06-13 |
-
1975
- 1975-06-10 JP JP6913675A patent/JPS51145590A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4947450A (fi) * | 1972-08-21 | 1974-05-08 | ||
| JPS4961241A (fi) * | 1972-09-21 | 1974-06-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51145590A (en) | 1976-12-14 |